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Name: XC3S1400AN-4FGG676I
Brand: AMD Xilinx
SKU: XC3S1400AN-4FGG676I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC3S1400AN-4FGG676I

Part No.:: XC3S1400AN-4FGG676I

Manufacturer:: AMD Xilinx

Package:: 676-BGA

Datasheet:: XC3S1400AN-4FGG676I.pdf

Description:: IC FPGA 502 I/O 676FBGA

In Stock:: 3182

Quantity:: Add To Cart

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XC3S1400AN-4FGG676I Specifications

Package/Case:
676-BGA
Packaging:
Tray
Series:
Spartan®-3AN
ProductStatus:
Active
NumberofLABs/CLBs:
2816
NumberofLogicElements/Cells:
25344
TotalRAMBits:
589824
NumberofI/O:
502
NumberofGates:
1400000
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XC3S1400AN-4FGG676I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC3S1400AN-4FGG676I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC3S1400AN-4FGG676I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC3S1400AN-4FGG676I information

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XC3S1400AN-4FGG676I Typical application Circuitry

The XC3S1400AN-4FGG676I is a Xilinx Spartan-3A FPGA (Field Programmable Gate Array). It is a powerful digital logic device that can be reprogrammed to implement various digital circuits, making it versatile and widely used in many applications, including data processing, communication systems, and embedded systems. Below are the steps to connect the XC3S1400AN-4FGG676I in a typical circuit:

1. Power Supply Pins (VCCINT, VCCAUX, VCCO): The XC3S1400AN-4FGG676I requires different power supply voltages for the internal core (VCCINT), auxiliary circuits (VCCAUX), and I/O banks (VCCO). Connect the VCCINT pins to a 1.2V supply, the VCCAUX pins to a 2.5V supply, and the VCCO pins to a supply voltage suitable for the chosen I/O standard (e.g., 3.3V, 2.5V, 1.8V). Decoupling capacitors should be put next to these pins to decrease voltage noise.

2. Ground Pins (GND): Connect all the GND pins to the ground plane of your PCB to establish a common reference for all signals.

3. Configuration Pins (DIN, CCLK, PROGRAM_B, etc.): The XC3S1400AN-4FGG676I can be configured through various methods, such as JTAG, Master Serial, or Slave Parallel. Connect the configuration pins (DIN, CCLK, PROGRAM_B, etc.) to the corresponding pins of the configuration memory or JTAG connector, following the recommended configuration scheme in the datasheet.

4. Clock Inputs (GCLK): Connect a stable clock source to one or more of the GCLK pins to provide the necessary clock signals for your FPGA design. The clock frequency and source will depend on your specific application requirements.

5. I/O Pins (IO_L, IO_R, IO_B, IO_T): The XC3S1400AN-4FGG676I has several I/O banks located on the left (L), right (R), bottom (B), and top (T) sides of the chip. Connect these I/O pins to your design's relevant inputs and outputs. Use proper termination resistors and consider signal integrity issues when routing high-speed signals.

6. Global Set/Reset (GSR): Connect the GSR pin to a reset signal source that initializes the FPGA upon startup. Typically, a push-button switch or microcontroller output can be used for this purpose.

7. Power-on Reset (POR): Implement a power-on reset circuit to ensure that the XC3S1400AN-4FGG676I starts up in a known state.

8. Heat Dissipation: The XC3S1400AN-4FGG676I creates heat during operation, which might impair performance and dependability. Attach a suitable heat sink to the package and use thermal vias to dissipate heat effectively.

By following these steps, you can connect the XC3S1400AN-4FGG676I FPGA to your circuit and achieve optimal performance. Make sure to consult the datasheet and user guide of the XC3S1400AN-4FGG676I for more detailed information, recommended PCB layout practices, and specific configuration procedures. Remember to pay attention to signal integrity, power distribution, and thermal management when designing your PCB.

XC3S1400AN-4FGG676I FAQ

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6. What is the process for return or replacement of XC3S1400AN-4FGG676I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC3S1400AN-4FGG676I we delivered, we will accept the replacement or return of the XC3S1400AN-4FGG676I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC3S1400AN-4FGG676I.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations