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Name: XC2V3000-4FG676C
Brand: AMD Xilinx
SKU: XC2V3000-4FG676C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC2V3000-4FG676C

Part No.:: XC2V3000-4FG676C

Manufacturer:: AMD Xilinx

Package:: 676-BGA

Datasheet:: XC2V3000-4FG676C.pdf

Description:: VIRTEX II FPGA

In Stock:: 2695

Quantity:: Add To Cart

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XC2V3000-4FG676C Specifications

Package/Case:
676-BGA
Packaging:
Bulk
Series:
Virtex®-II
ProductStatus:
Active
NumberofLABs/CLBs:
3584
NumberofLogicElements/Cells:
-
TotalRAMBits:
1769472
NumberofI/O:
484
NumberofGates:
3000000
Voltage-Supply:
1.425V ~ 1.575V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC2V3000-4FG676C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC2V3000-4FG676C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC2V3000-4FG676C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC2V3000-4FG676C information

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XC2V3000-4FG676C performance and reliability evaluation in extreme environments

XC2V3000-4FG676C is a high-density Field Programmable Gate Array (FPGA) manufactured by Xilinx, renowned for its versatility and performance. This FPGA offers a multitude of logic cells and configurable blocks, making it suitable for a wide range of applications, from telecommunications to aerospace.

Environmental Considerations:

In its design, XC2V3000-4FG676C takes into account various environmental factors to ensure reliable operation even in extreme conditions. High temperatures, low temperatures, humidity, and other environmental variables are carefully considered during the manufacturing process.

- Temperature: The XC2V3000-4FG676C is designed to withstand a wide temperature range, typically from -40°C to 100°C. This ensures its suitability for applications in both hot and cold environments, such as automotive, industrial, and aerospace systems.

- Humidity: The FPGA's packaging and sealing materials are chosen to provide protection against moisture and humidity, preventing corrosion and electrical malfunctions in humid environments.

- Thermal Management: Heat dissipation is carefully managed in the XC2V3000-4FG676C design to prevent overheating, especially during high-performance computing tasks. Heat sinks, thermal pads, and efficient PCB layout techniques are employed to ensure optimal thermal performance.

- Vibration and Shock: The FPGA undergoes rigorous testing to ensure its resilience against vibration and mechanical shock, crucial for applications in automotive and aerospace systems subjected to harsh vibrations.

Performance in Real-World Applications:

The XC2V3000-4FG676C FPGA demonstrates exceptional performance and reliability in various real-world applications, including but not limited to:

- Aerospace: In aerospace systems, the FPGA is used for tasks such as flight control, data processing, and communication. Its ability to operate reliably under extreme temperatures and withstand radiation makes it a preferred choice for space missions and satellite applications.

- Telecommunications: The FPGA plays a crucial role in telecommunications infrastructure, facilitating high-speed data processing, signal modulation/demodulation, and network management. Its flexibility allows for quick adaptation to evolving communication standards and protocols.

- Industrial Automation: In industrial settings, the FPGA enables advanced control and monitoring systems, overseeing processes such as manufacturing, robotics, and power distribution. Its robustness in harsh environments ensures uninterrupted operation in demanding industrial conditions.

- Medical Devices: The FPGA is utilized in medical equipment for tasks like image processing, patient monitoring, and diagnostic analysis. Its reliability and real-time processing capabilities contribute to the accuracy and efficiency of medical devices, enhancing patient care.

- Automotive: Within automotive electronics, the FPGA supports functions such as engine control, driver assistance systems, and infotainment. Its ability to withstand temperature fluctuations, vibrations, and electrical noise ensures reliable performance in vehicles operating in diverse environmental conditions.

Conclusion:

XC2V3000-4FG676C stands as a testament to Xilinx's commitment to delivering high-performance FPGAs capable of operating reliably in extreme environments. Its robust design, coupled with advanced manufacturing techniques and environmental considerations, makes it a preferred choice for mission-critical applications across various industries.

XC2V3000-4FG676C FAQ

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3. Are the XC2V3000-4FG676C price and inventory displayed accurate?

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XC2V3000-4FG676C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC2V3000-4FG676C we delivered, we will accept the replacement or return of the XC2V3000-4FG676C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC2V3000-4FG676C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations