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Name: XC2V1500-4BGG575C
Brand: AMD Xilinx
SKU: XC2V1500-4BGG575C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC2V1500-4BGG575C

Part No.:: XC2V1500-4BGG575C

Manufacturer:: AMD Xilinx

Package:: 575-BBGA

Datasheet:: XC2V1500-4BGG575C.pdf

Description:: IC FPGA 392 I/O 575BGA

In Stock:: 2826

Quantity:: Add To Cart

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XC2V1500-4BGG575C Specifications

Package/Case:
575-BBGA
Packaging:
Tray
Series:
Virtex®-II
ProductStatus:
Obsolete
NumberofLABs/CLBs:
1920
NumberofLogicElements/Cells:
-
TotalRAMBits:
884736
NumberofI/O:
392
NumberofGates:
1500000
Voltage-Supply:
1.425V ~ 1.575V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC2V1500-4BGG575C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC2V1500-4BGG575C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC2V1500-4BGG575C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC2V1500-4BGG575C information

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Basic introduction and simple engineering application of XC2V1500-4BGG575C

XC2V1500-4BGG575C is a powerful FPGA (Field Programmable Gate Array) chip manufactured by Xilinx, known for its high-performance computing capabilities and flexible reconfigurability. This FPGA features 1.5 million system gates and 1,152 user I/O pins, making it suitable for a wide range of applications in digital design and prototyping.

Application Scenario:

In digital signal processing applications, XC2V1500-4BGG575C can be utilized to implement complex algorithms for tasks such as image processing, audio filtering, and wireless communication signal modulation.

Project Overview:

Let's explore a simple project using XC2V1500-4BGG575C to create a digital dice roller. This project will involve creating a circuit that simulates rolling a six-sided dice and displaying the result on a seven-segment LED display.

Experiment Steps:

1. Design the Circuit:

Design the circuit using VHDL (VHSIC Hardware Description Language) or Verilog HDL to define the functionality of the digital dice roller. Utilize the resources of XC2V1500-4BGG575C to implement the random number generation algorithm and control logic for driving the LED display.

2. Implement Random Number Generation:

Develop a random number generator module using VHDL or Verilog HDL to generate numbers between 1 and 6, simulating the rolling of a dice. Ensure that the generated numbers have a uniform distribution and are independent of previous rolls.

3. Drive the LED Display:

Write code to control the seven-segment LED display based on the generated random number. Map each possible dice value to the corresponding LED segments to display the result accurately.

4. Synthesize and Implement:

Use Xilinx ISE or Vivado Design Suite to synthesize the HDL code and implement the design on the XC2V1500-4BGG575C FPGA. Ensure that the constraints are properly defined to meet the timing requirements and utilize the available resources efficiently.

5. Test the Prototype:

Once the design is implemented on the FPGA, test the prototype by simulating dice rolls and observing the results on the LED display. Verify that the generated numbers are random and that the display accurately reflects the rolled dice values.

Considerations:

When working on the project, consider the following:

- Resource Utilization: Optimize the design to make efficient use of the available FPGA resources, such as logic cells, memory blocks, and I/O pins, to accommodate future expansions or modifications.

- Timing Constraints: Ensure that the design meets timing constraints to prevent timing violations and guarantee reliable operation of the digital dice roller.

- Debugging and Testing: Use simulation tools and FPGA debugging features to identify and rectify any errors or issues in the design. Perform thorough testing to validate the functionality and performance of the prototype.

- Documentation: Document the design process, including circuit schematics, HDL code, synthesis reports, and test results, to facilitate future modifications or replication of the project.

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6. What is the process for return or replacement of XC2V1500-4BGG575C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC2V1500-4BGG575C we delivered, we will accept the replacement or return of the XC2V1500-4BGG575C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC2V1500-4BGG575C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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