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Name: XC2S200-6FGG256C
Brand: AMD Xilinx
SKU: XC2S200-6FGG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC2S200-6FGG256C

Part No.:: XC2S200-6FGG256C

Manufacturer:: AMD Xilinx

Package:: 256-BGA

Datasheet:: XC2S200-6FGG256C.pdf

Description:: IC FPGA 176 I/O 256FBGA

In Stock:: 3332

Quantity:: Add To Cart

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XC2S200-6FGG256C Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
Spartan®-II
ProductStatus:
Active
NumberofLABs/CLBs:
1176
NumberofLogicElements/Cells:
5292
TotalRAMBits:
57344
NumberofI/O:
176
NumberofGates:
200000
Voltage-Supply:
2.375V ~ 2.625V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

XC2S200-6FGG256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC2S200-6FGG256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC2S200-6FGG256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC2S200-6FGG256C information

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XC2S200-6FGG256C application case analysis in emerging technology fields

XC2S200-6FGG256C is a field-programmable gate array (FPGA) chip manufactured by Xilinx, renowned for its versatility and performance. It offers a wide range of configurable logic blocks and abundant resources, making it suitable for diverse applications across industries.

Application Scenario:

In the realm of telecommunications, XC2S200-6FGG256C can be instrumental in the development of high-speed data processing systems, such as baseband processing units in 5G networks.

Circuit Design:

To harness the capabilities of XC2S200-6FGG256C for a baseband processing unit, consider the following design aspects:

1. Data Processing Pipeline:

Utilize the configurable logic blocks (CLBs) and embedded multipliers within XC2S200-6FGG256C to implement a parallel processing pipeline for efficient data handling and manipulation.

2. High-Speed Interfaces:

Implement high-speed serial interfaces, such as Gigabit Ethernet or PCIe, using the dedicated transceivers available in XC2S200-6FGG256C. These interfaces facilitate seamless communication with external devices and networking equipment.

3. Signal Processing Algorithms:

Leverage the FPGA's computational capabilities to accelerate signal processing algorithms, such as FFT (Fast Fourier Transform) or FIR (Finite Impulse Response) filters, crucial for real-time data analysis in telecommunications systems.

4. Power Optimization:

Implement power-saving techniques, such as dynamic voltage and frequency scaling (DVFS), to optimize the power consumption of XC2S200-6FGG256C while maintaining performance during varying workload conditions.

5. System Integration:

Integrate peripheral components, such as DDR memory controllers and external ADCs (Analog-to-Digital Converters), with XC2S200-6FGG256C to meet the memory and I/O requirements of the baseband processing unit.

Considerations:

When designing the baseband processing unit, it's essential to address the following considerations:

- Timing Closure: Ensure that the design meets timing constraints to guarantee reliable operation at the target clock frequency.

- Resource Utilization: Optimize the utilization of CLBs, DSP slices, and memory resources to maximize the performance and efficiency of XC2S200-6FGG256C.

- Signal Integrity: Pay attention to signal integrity issues, such as impedance matching and signal termination, to mitigate signal degradation and ensure robust communication across high-speed interfaces.

- Thermal Management: Implement effective thermal management strategies, such as heat sinks or fans, to dissipate heat generated during operation and prevent thermal throttling.

- Security Considerations: Incorporate security features, such as bitstream encryption and authentication, to protect the intellectual property and integrity of the FPGA design in deployment scenarios.

XC2S200-6FGG256C FAQ

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3. Are the XC2S200-6FGG256C price and inventory displayed accurate?

The price and inventory of XC2S200-6FGG256C fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XC2S200-6FGG256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC2S200-6FGG256C we delivered, we will accept the replacement or return of the XC2S200-6FGG256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC2S200-6FGG256C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations