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Name: XC2C512-10FGG324C
Brand: AMD Xilinx
SKU: XC2C512-10FGG324C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XC2C512-10FGG324C

Part No.:: XC2C512-10FGG324C

Manufacturer:: AMD Xilinx

Package:: 324-BBGA

Datasheet:: XC2C512-10FGG324C.pdf

Description:: IC CPLD 512MC 9.2NS 324BGA

In Stock:: 3491

Quantity:: Add To Cart

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XC2C512-10FGG324C Specifications

Package/Case:
324-BBGA
Packaging:
Tray
Series:
CoolRunner II
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
9.2 ns
VoltageSupply-Internal:
1.7V ~ 1.9V
NumberofLogicElements/Blocks:
32
NumberofMacrocells:
512
NumberofGates:
12000
NumberofI/O:
270
OperatingTemperature:
0°C ~ 70°C (TA)
MountingType:
Surface Mount

XC2C512-10FGG324C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC2C512-10FGG324C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC2C512-10FGG324C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC2C512-10FGG324C information

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Common technical challenges and solutions when using XC2C512-10FGG324C

XC2C512-10FGG324C is a field-programmable gate array (FPGA) chip manufactured by Xilinx, offering high-performance digital logic capabilities suitable for a wide range of applications.

Technical Challenges:

When utilizing XC2C512-10FGG324C, several technical challenges may arise, including:

1. Noise Issues: High-frequency operation and signal integrity challenges can lead to noise issues, affecting overall system performance.

2. Power Consumption: FPGA devices like XC2C512-10FGG324C can consume significant power, especially during dynamic reconfiguration or heavy computation tasks, necessitating efficient power management strategies.

3. Integration Complexity: The complexity of integrating XC2C512-10FGG324C into a larger system design, including interfacing with other components and ensuring compatibility, can pose significant challenges.

Solutions and Improvements:

To address these challenges, consider the following strategies:

1. Noise Mitigation: Implement proper signal termination techniques, ground isolation, and routing guidelines to minimize noise susceptibility and ensure signal integrity within the FPGA circuitry.

2. Power Optimization: Utilize power gating techniques, clock gating, and dynamic voltage and frequency scaling (DVFS) to optimize power consumption during both idle and active states of XC2C512-10FGG324C.

3. System-Level Integration: Employ standardized communication protocols, such as SPI or I2C, for seamless integration of XC2C512-10FGG324C with other system components. Additionally, leverage modular design practices and IP core reuse to simplify integration efforts.

4. Thermal Management: Implement thermal monitoring mechanisms and thermal dissipation techniques, such as heatsinks or fans, to mitigate heat buildup and ensure reliable operation of XC2C512-10FGG324C under varying environmental conditions.

5. Design Verification: Perform thorough functional and performance testing, including simulation-based verification and hardware-in-the-loop (HIL) testing, to validate the functionality, reliability, and compliance of the XC2C512-10FGG324C-based system.

Conclusion:

By implementing these solutions and improvements, designers can overcome the technical challenges associated with XC2C512-10FGG324C integration, ensuring optimal performance, reliability, and efficiency of FPGA-based systems across various applications.

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6. What is the process for return or replacement of XC2C512-10FGG324C?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC2C512-10FGG324C.

(3)The PartNo is unused and only in the original unpacked packaging.

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