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Name: XC2C512-10FG324C
Brand: AMD Xilinx
SKU: XC2C512-10FG324C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XC2C512-10FG324C

Part No.:: XC2C512-10FG324C

Manufacturer:: AMD Xilinx

Package:: 324-BBGA

Datasheet:: XC2C512-10FG324C.pdf

Description:: IC CPLD 512MC 9.2NS 324BGA

In Stock:: 3919

Quantity:: Add To Cart

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XC2C512-10FG324C Specifications

Package/Case:
324-BBGA
Packaging:
Tray
Series:
CoolRunner II
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
9.2 ns
VoltageSupply-Internal:
1.7V ~ 1.9V
NumberofLogicElements/Blocks:
32
NumberofMacrocells:
512
NumberofGates:
12000
NumberofI/O:
270
OperatingTemperature:
0°C ~ 70°C (TA)
MountingType:
Surface Mount

XC2C512-10FG324C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC2C512-10FG324C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC2C512-10FG324C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC2C512-10FG324C information

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Common technical challenges and solutions when using XC2C512-10FG324C

XC2C512-10FG324C is a field-programmable gate array (FPGA) known for its versatility and flexibility, commonly used in digital circuit design for various applications. It features a large number of configurable logic blocks (CLBs), abundant routing resources, and fast performance.

Technical Challenges:

When utilizing XC2C512-10FG324C in designs, several technical challenges may arise, including:

1. Noise Issues: High-frequency operation and signal integrity challenges can lead to noise problems, affecting the reliability and performance of the FPGA-based system.

2. Power Consumption: The power consumption of XC2C512-10FG324C can be significant, especially in designs with high logic utilization or operating at high clock frequencies, leading to thermal management challenges.

3. Complexity of Integration: Integrating XC2C512-10FG324C into a larger system design with other components and interfaces can introduce complexity in terms of design verification, debugging, and system integration.

Solutions and Improvements:

To address these challenges, the following solutions and improvements can be implemented:

1. Noise Mitigation: Utilize proper grounding techniques, decoupling capacitors, and signal termination to minimize noise effects on XC2C512-10FG324C signals. Implement clock distribution networks carefully to ensure signal integrity.

2. Power Optimization: Employ power management techniques such as clock gating, power gating, and dynamic voltage and frequency scaling (DVFS) to reduce the power consumption of XC2C512-10FG324C during idle or low-utilization periods.

3. System-Level Design: Adopt a modular and hierarchical design approach to manage the complexity of integrating XC2C512-10FG324C with other system components. Utilize standardized interfaces and communication protocols for seamless integration and interoperability.

4. Firmware Optimization: Optimize the FPGA firmware to minimize resource utilization, reduce logic complexity, and improve timing closure, enhancing the overall performance and efficiency of the XC2C512-10FG324C-based design.

5. Thermal Management: Implement proper heat sinking, thermal vias, and thermal monitoring mechanisms to manage the thermal profile of XC2C512-10FG324C and prevent overheating issues, ensuring reliable operation under varying environmental conditions.

Considerations:

- Timing Closure: Ensure that the design meets timing requirements to avoid timing violations and ensure reliable operation of XC2C512-10FG324C-based systems.

- Design Verification: Thoroughly test the design using simulation, emulation, and prototyping techniques to validate functionality, performance, and reliability before deployment.

- Documentation and Collaboration: Maintain comprehensive documentation and facilitate effective collaboration among design teams to streamline the development process and mitigate integration challenges.

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6. What is the process for return or replacement of XC2C512-10FG324C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC2C512-10FG324C we delivered, we will accept the replacement or return of the XC2C512-10FG324C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC2C512-10FG324C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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