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Name: XC2C384-10FGG324I
Brand: AMD Xilinx
SKU: XC2C384-10FGG324I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XC2C384-10FGG324I

Part No.:: XC2C384-10FGG324I

Manufacturer:: AMD Xilinx

Package:: 324-BBGA

Datasheet:: XC2C384-10FGG324I.pdf

Description:: IC CPLD 384MC 9.2NS 324FBGA

In Stock:: 3021

Quantity:: Add To Cart

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XC2C384-10FGG324I Specifications

Package/Case:
324-BBGA
Packaging:
Tray
Series:
CoolRunner II
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
9.2 ns
VoltageSupply-Internal:
1.7V ~ 1.9V
NumberofLogicElements/Blocks:
24
NumberofMacrocells:
384
NumberofGates:
9000
NumberofI/O:
240
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XC2C384-10FGG324I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC2C384-10FGG324I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC2C384-10FGG324I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC2C384-10FGG324I information

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Common technical challenges and solutions when using XC2C384-10FGG324I

XC2C384-10FGG324I is a field-programmable gate array (FPGA) widely used in digital design projects for its versatility and reconfigurability. However, its utilization comes with several common technical challenges that need to be addressed for optimal performance.

Noise Issues:

To mitigate noise problems in XC2C384-10FGG324I designs, implement proper grounding techniques, use decoupling capacitors strategically across the power rails, and employ differential signaling for high-speed interfaces to reduce susceptibility to electromagnetic interference (EMI).

Power Consumption:

Reduce power consumption by optimizing the design's logic utilization, employing clock gating techniques to disable unused logic blocks, and utilizing power management features available in the FPGA, such as dynamic voltage and frequency scaling (DVFS).

Integration Complexity:

Simplify integration complexity by modularizing the design, breaking it down into smaller, manageable blocks with well-defined interfaces. Utilize hierarchical design methodologies and leverage IP cores to encapsulate commonly used functionalities, reducing design complexity and enhancing reusability.

Timing Closure:

Achieve timing closure by carefully analyzing timing constraints, optimizing critical paths, and balancing logic distribution across the FPGA fabric. Utilize synthesis and place-and-route optimization techniques, such as pipelining and register retiming, to meet timing requirements.

Configuration Management:

Streamline configuration management by implementing robust configuration interfaces and protocols, ensuring reliable programming and reprogramming of XC2C384-10FGG324I devices. Employ error detection and correction mechanisms to enhance configuration reliability and integrity.

Testing and Verification:

Thoroughly test and verify XC2C384-10FGG324I designs using simulation, emulation, and prototyping techniques. Implement comprehensive testbenches to validate functional correctness, performance, and reliability under various operating conditions.

Considerations:

When designing with XC2C384-10FGG324I, consider factors such as:

- Signal Integrity: Ensure signal integrity through proper board layout and routing practices to minimize signal degradation and timing skew.

- Design Security: Implement security measures, such as bitstream encryption and authentication, to protect sensitive intellectual property (IP) embedded within the FPGA design.

- Design For Testability (DFT): Incorporate built-in self-test (BIST) features and debug interfaces to facilitate testing, diagnosis, and debugging of XC2C384-10FGG324I designs during development and in-field operation.

- Compliance and Standards: Ensure compliance with industry standards and regulations, such as JEDEC, IEEE, and ISO, to guarantee interoperability, reliability, and safety of XC2C384-10FGG324I based systems.

XC2C384-10FGG324I FAQ

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3. Are the XC2C384-10FGG324I price and inventory displayed accurate?

The price and inventory of XC2C384-10FGG324I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of XC2C384-10FGG324I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC2C384-10FGG324I we delivered, we will accept the replacement or return of the XC2C384-10FGG324I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC2C384-10FGG324I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations