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Name: XC2C384-10FG324I
Brand: AMD Xilinx
SKU: XC2C384-10FG324I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XC2C384-10FG324I

Part No.:: XC2C384-10FG324I

Manufacturer:: AMD Xilinx

Package:: 324-BBGA

Datasheet:: XC2C384-10FG324I.pdf

Description:: IC CPLD 384MC 9.2NS 324FBGA

In Stock:: 3232

Quantity:: Add To Cart

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XC2C384-10FG324I Specifications

Package/Case:
324-BBGA
Packaging:
Tray
Series:
CoolRunner II
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
9.2 ns
VoltageSupply-Internal:
1.7V ~ 1.9V
NumberofLogicElements/Blocks:
24
NumberofMacrocells:
384
NumberofGates:
9000
NumberofI/O:
240
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XC2C384-10FG324I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC2C384-10FG324I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC2C384-10FG324I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC2C384-10FG324I information

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Common technical challenges and solutions when using XC2C384-10FG324I

XC2C384-10FG324I is a FPGA (Field Programmable Gate Array) device commonly utilized in various digital design applications, offering reconfigurable logic capabilities and flexibility in hardware implementation.

Technical Challenges:

When working with XC2C384-10FG324I, several technical challenges may arise, including:

1. Noise Issues: High-speed digital circuits on the FPGA may generate electromagnetic interference (EMI), leading to noise problems affecting circuit performance.

2. Power Consumption: FPGA devices like XC2C384-10FG324I can consume significant power, especially during configuration and operation, posing challenges for power management and thermal dissipation.

3. Integration Complexity: Integrating various hardware components and ensuring compatibility with the FPGA, such as external memory interfaces or communication protocols, can be complex and require meticulous design considerations.

4. Signal Integrity: Maintaining signal integrity across the FPGA and associated peripherals is crucial for reliable operation, requiring attention to routing techniques, termination schemes, and impedance matching.

5. Timing Closure: Achieving timing closure, ensuring that all timing requirements are met across the FPGA design, can be challenging due to factors like signal propagation delays and routing congestion.

Solutions and Improvements:

To address these challenges when working with XC2C384-10FG324I, consider the following solutions and improvements:

- Noise Mitigation Techniques: Implement proper grounding, shielding, and signal isolation techniques to minimize noise interference. Use differential signaling and filtering components where necessary.

- Power Optimization: Utilize power management techniques such as clock gating, voltage scaling, and dynamic power management to reduce overall power consumption and enhance energy efficiency.

- Modular Design: Break down the system into modular blocks and use standardized interfaces to simplify integration and facilitate reusability of design components.

- High-Speed Design Practices: Employ best practices for high-speed PCB layout and routing, including controlled impedance traces, length matching, and minimizing signal reflections to maintain signal integrity.

- Advanced Timing Analysis: Leverage FPGA vendor tools for advanced timing analysis and optimization, utilizing techniques like pipelining, retiming, and constraint optimization to achieve timing closure.

Conclusion:

By employing these strategies and leveraging appropriate design methodologies, engineers can effectively overcome the technical challenges associated with XC2C384-10FG324I FPGA devices and develop robust and reliable digital systems for diverse applications.

XC2C384-10FG324I FAQ

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3. Are the XC2C384-10FG324I price and inventory displayed accurate?

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6. What is the process for return or replacement of XC2C384-10FG324I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC2C384-10FG324I we delivered, we will accept the replacement or return of the XC2C384-10FG324I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC2C384-10FG324I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations