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Name: XC2C256-7PQG208I
Brand: AMD Xilinx
SKU: XC2C256-7PQG208I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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AMD Xilinx XC2C256-7PQG208I

Part No.:: XC2C256-7PQG208I

Manufacturer:: AMD Xilinx

Package:: 208-BFQFP

Datasheet:: XC2C256-7PQG208I.pdf

Description:: IC CPLD 256MC 6.7NS 208QFP

In Stock:: 2274

Quantity:: Add To Cart

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XC2C256-7PQG208I Specifications

Package/Case:
208-BFQFP
Packaging:
Tray
Series:
CoolRunner II
ProductStatus:
Obsolete
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
6.7 ns
VoltageSupply-Internal:
1.7V ~ 1.9V
NumberofLogicElements/Blocks:
16
NumberofMacrocells:
256
NumberofGates:
6000
NumberofI/O:
173
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XC2C256-7PQG208I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XC2C256-7PQG208I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XC2C256-7PQG208I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XC2C256-7PQG208I information

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Common technical challenges and solutions when using XC2C256-7PQG208I

XC2C256-7PQG208I is a field-programmable gate array (FPGA) commonly utilized in various electronic applications for its reconfigurable nature and high integration capabilities.

Technical Challenges:

When employing XC2C256-7PQG208I in designs, several technical challenges may arise, including:

1. Noise Issues: Due to the complexity of FPGA circuits and high switching speeds, noise interference can degrade signal integrity and affect overall system performance.

2. Power Consumption: FPGA devices like XC2C256-7PQG208I often demand significant power, which can pose challenges in power management and thermal dissipation.

3. Integration Complexity: Integrating XC2C256-7PQG208I into a larger system requires careful consideration of interfaces, signal routing, and peripheral integration, increasing design complexity.

Solutions and Improvements:

To address these challenges, the following solutions and improvements can be implemented:

1. Noise Mitigation Techniques: Utilize proper grounding techniques, signal isolation, and shielding to reduce noise interference in FPGA-based designs. Implement differential signaling and impedance matching where necessary to enhance signal integrity.

2. Power Optimization: Employ power-aware design methodologies such as clock gating, power gating, and voltage scaling to minimize power consumption in XC2C256-7PQG208I designs. Utilize power analysis tools to identify and optimize power-hungry sections of the design.

3. Design Partitioning: Break down complex designs into manageable modules and utilize hierarchical design techniques to streamline integration with XC2C256-7PQG208I. Utilize IP cores and standardized interfaces to simplify integration with peripheral components.

4. Thermal Management: Implement thermal management strategies such as heat sinks, fans, and thermal vias to dissipate heat generated by XC2C256-7PQG208I and prevent overheating. Perform thermal simulations and testing to ensure reliable operation under various operating conditions.

5. Verification and Testing: Conduct thorough verification and testing of XC2C256-7PQG208I designs to validate functionality, performance, and reliability. Utilize simulation tools, emulation platforms, and hardware-in-the-loop testing to identify and address potential issues early in the design cycle.

Conclusion:

By implementing these solutions and improvements, designers can effectively overcome the technical challenges associated with XC2C256-7PQG208I and develop robust and high-performance FPGA-based systems for various applications.

XC2C256-7PQG208I FAQ

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6. What is the process for return or replacement of XC2C256-7PQG208I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC2C256-7PQG208I we delivered, we will accept the replacement or return of the XC2C256-7PQG208I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC2C256-7PQG208I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations