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Name: XAZU2EG-1SFVA625Q
Brand: Xilinx Inc.
SKU: XAZU2EG-1SFVA625Q
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Xilinx Inc. XAZU2EG-1SFVA625Q

Part No.:: XAZU2EG-1SFVA625Q

Manufacturer:: Xilinx Inc.

Package:: 625-BFBGA, FCBGA

Datasheet:: XAZU2EG-1SFVA625Q.pdf

Description:: IC SOC CORTEX-A53 625FCBGA

In Stock:: 2362

Quantity:: Add To Cart

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XAZU2EG-1SFVA625Q Specifications

Package/Case:
625-BFBGA, FCBGA
Packaging:
Tray
Series:
Zynq® UltraScale+™ MPSoC EG
ProductStatus:
Active
Architecture:
MPU, FPGA
CoreProcessor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
FlashSize:
-
RAMSize:
1.2MB
Peripherals:
DMA, WDT
Connectivity:
CANbus, I²C, SPI, UART/USART, USB
Speed:
500MHz, 1.2GHz
PrimaryAttributes:
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
OperatingTemperature:
-40°C ~ 125°C (TJ)

XAZU2EG-1SFVA625Q this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XAZU2EG-1SFVA625Q price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XAZU2EG-1SFVA625Q to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XAZU2EG-1SFVA625Q information

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XAZU2EG-1SFVA625Q Typical application Circuitry

The XAZU2EG-1SFVA625Q is a member of the Xilinx Zynq UltraScale+ MPSoC family. A powerful 64-bit quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processing system (PS) is combined with Xilinx FPGA logic in a single device. This series is particularly aimed at next-generation systems that require high-performance, a blend of advanced processing capabilities, and versatile programmability, suitable for applications in automotive, 5G wireless, industrial, and aerospace and defense.

1. Power Supply Connection Strategy: To power the XAZU2EG-1SFVA625Q, various supply voltages must be provided, including VCCINT for the internal logic, VCCBRAM for the Block RAM, VCCAUX for the auxiliary supply, and VCC_PSINTLP and VCC_PSINTFP for the low and full power domains of the processing system respectively. Each supply voltage should be applied to the designated pins and be accompanied by suitable decoupling capacitors to ensure stability and minimize noise.

2. Grounding Essentials: All GND pins on the XAZU2EG-1SFVA625Q need to be securely tied to the system ground. This is critical for establishing a common reference point for all signals and for supporting signal integrity across the device.

3. Configuration and Booting: The XAZU2EG-1SFVA625Q requires configuration of both the processing system and the programmable logic. Pins involved in this process include the PROGRAM_B, INIT_B, and various mode pins (MODE[0:4]) which must be correctly interfaced to the configuration memory or external programming sources. For booting the processing system, proper connections to the PS boot mode pins are necessary to select the boot mode.

4. I/O Pin Handling: The multifunctional I/O pins of the XAZU2EG-1SFVA625Q should be connected according to the voltage levels required by the peripherals and within the parameters specified for the device. Each I/O bank has its own VCCO pin that needs to be supplied with the correct I/O voltage.

5. Clock Distribution: Clock input pins of the XAZU2EG-1SFVA625Q should be linked to a reliable and precise clock source. The device's sophisticated clocking capabilities, including PLLs and MMCMs, facilitate precise clock management for both the processing system and the programmable logic.

6. Thermal Management Practices: Given the complexity and performance capabilities of the XAZU2EG-1SFVA625Q, managing the thermal load is imperative. The use of thermal dissipation solutions, such as heat sinks and thermal pads, in combination with proper PCB layout for heat spreading, is essential to maintain operational temperatures within safe limits.

7. Signal Integrity Considerations: The high-speed transceivers and I/Os of the XAZU2EG-1SFVA625Q demand a PCB design that adheres to best practices in signal integrity. This includes differential signaling, controlled impedance traces, and proper termination where required to ensure the integrity of high-speed data.

By meticulously planning the power supply connections, grounding, configuration and booting procedures, I/O interfacing, clock distribution, thermal management, and signal integrity, the XAZU2EG-1SFVA625Q can be fully leveraged to drive sophisticated and computationally demanding systems, delivering the combined advantages of an ARM-based processor and programmable FPGA logic.

XAZU2EG-1SFVA625Q FAQ

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6. What is the process for return or replacement of XAZU2EG-1SFVA625Q?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XAZU2EG-1SFVA625Q we delivered, we will accept the replacement or return of the XAZU2EG-1SFVA625Q only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XAZU2EG-1SFVA625Q.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations