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Name: XA7S100-2FGGA676I
Brand: AMD Xilinx
SKU: XA7S100-2FGGA676I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XA7S100-2FGGA676I

Part No.:: XA7S100-2FGGA676I

Manufacturer:: AMD Xilinx

Package:: 676-BGA

Datasheet:: XA7S100-2FGGA676I.pdf

Description:: IC FPGA 400 I/O 676FBGA

In Stock:: 2018

Quantity:: Add To Cart

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XA7S100-2FGGA676I Specifications

Package/Case:
676-BGA
Packaging:
Tray
Series:
Automotive, AEC-Q100, Spartan®-7 XA
ProductStatus:
Active
NumberofLABs/CLBs:
8000
NumberofLogicElements/Cells:
102400
TotalRAMBits:
4423680
NumberofI/O:
400
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

XA7S100-2FGGA676I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XA7S100-2FGGA676I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XA7S100-2FGGA676I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XA7S100-2FGGA676I information

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XA7S100-2FGGA676I application case analysis in emerging technology fields

XA7S100-2FGGA676I is a high-performance field-programmable gate array (FPGA) manufactured by Xilinx, featuring advanced capabilities and versatility for a wide range of applications.

Application Scenario:

In the aerospace industry, XA7S100-2FGGA676I can be utilized to enhance onboard processing capabilities of satellite systems, enabling real-time data processing and analysis for tasks such as remote sensing and image processing.

System Architecture:

To implement XA7S100-2FGGA676I in a satellite onboard processing system, the following architecture can be considered:

1. Sensor Interface:

Connect various sensors, such as cameras or spectrometers, to the input ports of XA7S100-2FGGA676I through appropriate interface modules. These sensors capture raw data from the satellite's surroundings.

2. Data Processing:

Utilize the FPGA's high-speed processing capabilities to perform real-time data processing tasks, such as image compression, feature extraction, or spectral analysis. Implement parallel processing architectures to maximize throughput.

3. Algorithm Implementation:

Implement custom algorithms or signal processing routines using the FPGA's reconfigurable logic resources. These algorithms can be tailored to specific mission objectives, such as object detection or anomaly detection.

4. Communication:

Establish communication links with ground stations or other satellites using onboard communication modules. The FPGA can handle data transmission protocols and encryption/decryption tasks to ensure secure data exchange.

5. Power Management:

Implement efficient power management strategies to optimize power consumption and extend the satellite's operational lifespan. Utilize dynamic voltage and frequency scaling techniques to adjust the FPGA's power consumption based on processing requirements.

Benefits:

By integrating XA7S100-2FGGA676I into satellite onboard processing systems, several benefits can be realized:

- High Performance: The FPGA's parallel processing architecture and reconfigurable logic enable high-speed data processing, essential for real-time applications.

- Flexibility: The FPGA can be reprogrammed in orbit to adapt to changing mission requirements or incorporate new functionalities, extending the satellite's operational lifespan.

- Reliability: Xilinx FPGAs are known for their robustness and radiation-hardened designs, ensuring reliable operation in the harsh space environment.

- Scalability: The modular architecture allows for easy scalability, enabling the addition of new sensors or processing modules without significant redesign.

- Cost-effectiveness: By consolidating multiple processing tasks onto a single FPGA chip, overall system complexity and cost can be reduced compared to traditional multi-chip solutions.

Considerations:

When designing the satellite onboard processing system, it's essential to consider:

- Radiation Effects: Evaluate the FPGA's susceptibility to radiation-induced errors and implement mitigation techniques such as triple modular redundancy (TMR) or error-correcting codes (ECC).

- Thermal Management: Ensure adequate thermal dissipation measures are in place to prevent overheating of the FPGA chip and other onboard components.

- Signal Integrity: Design the PCB layout and signal routing to minimize signal degradation and ensure reliable communication between the FPGA and other system components.

- Compliance: Ensure that the satellite onboard processing system complies with relevant space industry standards and regulations, including electromagnetic compatibility (EMC) and environmental testing requirements.

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6. What is the process for return or replacement of XA7S100-2FGGA676I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XA7S100-2FGGA676I we delivered, we will accept the replacement or return of the XA7S100-2FGGA676I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XA7S100-2FGGA676I.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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