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Name: XA2C256-7VQG100I
Brand: AMD Xilinx
SKU: XA2C256-7VQG100I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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AMD Xilinx XA2C256-7VQG100I

Part No.:: XA2C256-7VQG100I

Manufacturer:: AMD Xilinx

Package:: 100-TQFP

Datasheet:: XA2C256-7VQG100I.pdf

Description:: IC CPLD 256MC 7NS 100VQFP

In Stock:: 2068

Quantity:: Add To Cart

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XA2C256-7VQG100I Specifications

Package/Case:
100-TQFP
Packaging:
Tray
Series:
CoolRunner II
ProductStatus:
Active
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
7 ns
VoltageSupply-Internal:
1.7V ~ 1.9V
NumberofLogicElements/Blocks:
16
NumberofMacrocells:
256
NumberofGates:
6000
NumberofI/O:
80
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

XA2C256-7VQG100I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including XA2C256-7VQG100I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for XA2C256-7VQG100I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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XA2C256-7VQG100I information

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Common technical challenges and solutions when using XA2C256-7VQG100I

XA2C256-7VQG100I is a complex FPGA device manufactured by Xilinx, offering extensive programmable logic capabilities and high-speed performance suitable for diverse applications in telecommunications, data processing, and embedded systems.

Noise Challenges:

To mitigate noise issues in XA2C256-7VQG100I designs, implement proper decoupling techniques by placing capacitors close to power pins to suppress high-frequency noise. Additionally, employ ground planes and power planes effectively to minimize signal interference and ensure signal integrity.

Power Consumption:

Reduce power consumption in XA2C256-7VQG100I designs by optimizing the logic synthesis process to minimize unnecessary switching activity. Utilize power gating techniques to selectively power down unused logic blocks and employ clock gating to disable clock signals to idle logic elements, reducing dynamic power consumption.

Integration Complexity:

Simplify integration complexities in XA2C256-7VQG100I designs by adopting modular design methodologies, breaking down the overall design into smaller functional blocks. Utilize hierarchical design techniques to manage design complexity effectively, allowing for easier verification, debugging, and maintenance of the FPGA design.

High-Speed Design:

Ensure signal integrity in XA2C256-7VQG100I designs by carefully considering transmission line effects and impedance matching techniques. Implement proper termination schemes, such as series terminations or parallel terminations, to minimize signal reflections and ensure reliable high-speed data transmission.

Thermal Management:

Manage thermal challenges in XA2C256-7VQG100I designs by employing efficient heat sinks and thermal management solutions. Ensure adequate airflow and ventilation in the system enclosure to dissipate heat effectively and prevent thermal throttling, which can degrade FPGA performance and reliability.

Considerations:

- Timing Closure: Perform thorough timing analysis and optimization to ensure timing constraints are met, avoiding timing violations that can result in functional errors or reduced performance.

- Resource Utilization: Optimize FPGA resource utilization by carefully mapping design elements to physical FPGA resources, minimizing resource wastage and maximizing design efficiency.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect intellectual property and prevent unauthorized access or tampering with the FPGA configuration.

- Design Validation: Conduct extensive simulation and verification testing to validate the functionality, performance, and reliability of the XA2C256-7VQG100I design under various operating conditions and corner cases.

XA2C256-7VQG100I FAQ

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6. What is the process for return or replacement of XA2C256-7VQG100I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XA2C256-7VQG100I we delivered, we will accept the replacement or return of the XA2C256-7VQG100I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XA2C256-7VQG100I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations