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Name: TMS32C6416DGLZ7E3
Brand: Texas Instruments
SKU: TMS32C6416DGLZ7E3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Texas Instruments TMS32C6416DGLZ7E3

Part No.:: TMS32C6416DGLZ7E3

Manufacturer:: Texas Instruments

Package:

Datasheet:: TMS32C6416DGLZ7E3.pdf

Description:: IC FIXED-POINT DSP 532-FCBGA

In Stock:: 215

Quantity:: Add To Cart

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TMS32C6416DGLZ7E3 Specifications

Package/Case:
Packaging:
Tube,Tube
Series:
TMS320C6414/15/16
ProductStatus:
Obsolete
Type:
Fixed Point
Interface:
Host Interface, McBSP, PCI, UTOPIA
ClockRate:
720MHz
Non-VolatileMemory:
External
On-ChipRAM:
1.03MB
Voltage-I/O:
3.30V
Voltage-Core:
1.40V
OperatingTemperature:
0°C ~ 90°C (TC)
MountingType:
Surface Mount

TMS32C6416DGLZ7E3 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including TMS32C6416DGLZ7E3 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for TMS32C6416DGLZ7E3 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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TMS32C6416DGLZ7E3 information

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TMS32C6416DGLZ7E3 performance and reliability evaluation in extreme environments

TMS32C6416DGLZ7E3 is a digital signal processor (DSP) chip known for its exceptional performance and reliability, especially in extreme environmental conditions. When designing systems using TMS32C6416DGLZ7E3, engineers must carefully consider factors such as high temperature, low temperature, humidity, and other environmental variables to ensure optimal performance and longevity.

Environmental Considerations:

In applications where TMS32C6416DGLZ7E3 is deployed, such as aerospace, automotive, or industrial settings, the operating environment can vary significantly. Extreme temperatures, ranging from -40°C to 125°C or even higher, may be encountered. Additionally, humidity levels and exposure to moisture can pose challenges to the reliability of electronic components.

Design Strategies:

To address these environmental challenges, designers incorporate various strategies into the system architecture and component selection:

- Temperature Management: Implement thermal management techniques, such as heat sinks, fans, or thermal compounds, to regulate the temperature around TMS32C6416DGLZ7E3 within the specified operating range. Additionally, select components rated for high-temperature operation to withstand extreme conditions.

- Humidity Protection: Seal the system enclosure to prevent moisture ingress, and use conformal coating on PCBs to protect against humidity-related damage. Choose components with high humidity resistance to ensure long-term reliability.

- Vibration and Shock Resistance: Employ mechanical reinforcement and shock-absorbing mounts to mitigate the effects of vibrations and shocks encountered in rugged environments, such as automotive or aerospace applications.

- EMI/EMC Compliance: Shield sensitive components and traces, and use filtering techniques to minimize electromagnetic interference (EMI). Ensure compliance with electromagnetic compatibility (EMC) standards to prevent signal degradation or interference.

Performance Evaluation:

In practical applications, TMS32C6416DGLZ7E3 demonstrates robust performance and reliability even in harsh environmental conditions. Its advanced architecture and built-in features, such as error correction codes (ECC) and fault tolerance mechanisms, contribute to enhanced resilience against environmental stressors.

Conclusion:

Overall, TMS32C6416DGLZ7E3 exhibits outstanding performance and reliability in extreme environmental conditions when appropriately designed and implemented. By considering factors such as temperature, humidity, vibration, and EMC compliance during the design phase, engineers can ensure the successful deployment of TMS32C6416DGLZ7E3-based systems in demanding applications.

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6. What is the process for return or replacement of TMS32C6416DGLZ7E3?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the TMS32C6416DGLZ7E3 we delivered, we will accept the replacement or return of the TMS32C6416DGLZ7E3 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of TMS32C6416DGLZ7E3.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations