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Name: TMS320VC5509AGBB
Brand: Texas Instruments
SKU: TMS320VC5509AGBB
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Texas Instruments TMS320VC5509AGBB

Part No.:: TMS320VC5509AGBB

Manufacturer:: Texas Instruments

Package:

Datasheet:

Description:: IC DSP FIX PT 16-BIT 179-BGA

In Stock:: 3743

Quantity:: Add To Cart

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TMS320VC5509AGBB Specifications

Package/Case:
Packaging:
Tray
Series:
TMS320C55x
ProductStatus:
Active
Type:
Fixed Point
Interface:
Host Interface, I²C, McBSP
ClockRate:
200MHz
Non-VolatileMemory:
ROM (64kB)
On-ChipRAM:
256kB
Voltage-I/O:
3V, 3.3V
Voltage-Core:
1.60V
OperatingTemperature:
-40°C ~ 85°C (TC)
MountingType:
Surface Mount

TMS320VC5509AGBB this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including TMS320VC5509AGBB price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for TMS320VC5509AGBB to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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TMS320VC5509AGBB information

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TMS320VC5509AGBB performance and reliability evaluation in extreme environments

TMS320VC5509AGBB is a digital signal processor (DSP) chip manufactured by Texas Instruments, designed for high-performance signal processing applications in extreme environments. It offers advanced features such as a 16-bit fixed-point DSP core, integrated memory, and various peripherals.

Application Scenario:

In applications requiring signal processing in extreme environments, TMS320VC5509AGBB can be utilized for tasks such as audio processing in aerospace and defense systems, industrial control in harsh manufacturing environments, and medical imaging in rugged medical equipment.

Design Considerations:

When designing systems with TMS320VC5509AGBB for extreme environments, several environmental factors must be considered:

- Temperature: The operating temperature range of TMS320VC5509AGBB should be within the specified limits to ensure reliable operation. Proper thermal management techniques, such as heatsinking or active cooling, may be required to maintain the chip's temperature within acceptable bounds.

- Humidity: Moisture levels in the environment can affect the performance and reliability of TMS320VC5509AGBB. Enclosure design and conformal coating may be necessary to protect the chip from humidity-induced damage.

- Vibration and Shock: In applications subject to mechanical stress, such as aerospace or automotive systems, TMS320VC5509AGBB must be ruggedized to withstand vibration and shock without compromising performance or reliability. Shock-absorbing mounting techniques and ruggedized enclosures can help mitigate these effects.

- EMI/EMC: Electromagnetic interference (EMI) and electromagnetic compatibility (EMC) considerations are crucial for ensuring that TMS320VC5509AGBB operates reliably in environments with high levels of electromagnetic noise. Proper shielding, grounding, and filtering techniques must be employed to minimize EMI/EMC issues.

Performance Analysis:

In real-world applications, TMS320VC5509AGBB has demonstrated excellent performance and reliability in extreme environments. For example, in aerospace applications, it has been used for real-time audio processing in cockpit communication systems, where it has proven its ability to operate reliably under high vibration and temperature extremes.

In industrial control applications, TMS320VC5509AGBB has been deployed in programmable logic controllers (PLCs) for monitoring and controlling manufacturing processes in harsh environments. Its robust performance and integrated peripherals make it well-suited for such demanding applications.

In medical imaging equipment, TMS320VC5509AGBB has been utilized for real-time signal processing tasks, where its high processing power and low latency enable fast and accurate image processing even in rugged medical environments.

Conclusion:

TMS320VC5509AGBB is a versatile DSP chip capable of delivering high-performance signal processing in extreme environments. By considering environmental factors such as temperature, humidity, vibration, and EMI/EMC, designers can ensure the reliable operation of systems built around this chip in a wide range of challenging applications.

TMS320VC5509AGBB FAQ

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6. What is the process for return or replacement of TMS320VC5509AGBB?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the TMS320VC5509AGBB we delivered, we will accept the replacement or return of the TMS320VC5509AGBB only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of TMS320VC5509AGBB.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations