TDA4VM88TGBALFRQ1

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Texas Instruments TDA4VM88TGBALFRQ1

HIGH-RELIABILITY-COMPONENTS
Part No.:
TDA4VM88TGBALFRQ1
Manufacturer:
Texas Instruments
Package:
827-BFBGA, FCBGA
Datasheet:
Description:
NEXT GENERATION SOC FAMILY FOR L
In Stock:
3988
Quantity:
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    TDA4VM88TGBALFRQ1 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including TDA4VM88TGBALFRQ1 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for TDA4VM88TGBALFRQ1 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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    TDA4VM88TGBALFRQ1 informationTDA4VM88TGBALFRQ1 information

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    TDA4VM88TGBALFRQ1 Typical application Circuitry

    TDA4VM88TGBALFRQ1

    The TDA4VM88TGBALFRQ1 from Texas Instruments is a high-performance System-on-Chip (SoC) designed for automotive applications. This SoC is appropriate for a variety of applications because to its wide range of features and capabilities. Below is a general guide for integrating the TDA4VM88TGBALFRQ1 into your circuit:

    1. Power Supply: Power supply pins (VDD*) should be connected to their respective voltages as per the data sheet's power supply scheme. Ground pins (VSS*) should be tied to your circuit's ground. To maintain the reliability of the power supply, decoupling capacitors should be positioned close to these pins.

    2. Clock Source: Connect a crystal oscillator to the RTC_STALIN and RTC_ABOUT pins to provide a clock source.

    3. Reset: Reston is the reset output from the device and should be used to reset other devices in the system when the SoC resets. The Port pin is used for power-on reset.

    4. Boot Mode Selection: Connect boot mode selection pins (POSTCODE*) to either VDD or VSS to select the boot mode as per your application's needs.

    5. Thermal Management: The THERM pin is used to monitor the SoC's temperature. Connect it to a thermal management circuit or system in your application to manage heat dissipation.

    6. Communication Interfaces: For Ethernet communication, the MDI and MDC pins are used. For CAN communication, use the CAN_TX and CAN_RX pins. Other communication peripherals like I2C, SPI, and PART also have dedicated pins which can be used as per your requirements.

    7. System Wake-up: To awaken the system from low-power settings, utilize the MAKEUP pin. Connect it to a microcontroller GPO or another appropriate source in your system.

    This is just a general connection guide. Always consult the technical reference handbook and data sheet for the TDA4VM88TGBALFRQ1 for additional in-depth information. To guarantee the dependable and secure operation of your electrical circuits, always follow appropriate circuit design principles.

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    6. What is the process for return or replacement of TDA4VM88TGBALFRQ1?

    All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the TDA4VM88TGBALFRQ1 we delivered, we will accept the replacement or return of the TDA4VM88TGBALFRQ1 only when all of the below conditions are fulfilled:

    (1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

    (2)We are informed of the defect described above within 90 days after the delivery of TDA4VM88TGBALFRQ1.

    (3)The PartNo is unused and only in the original unpacked packaging.

    Two processes to return the products:

    (1)Inform us within 90 days

    (2)Obtain Requesting Return Authorizations

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