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Name: M4A3-384/192-12FANI
Brand: Lattice Semiconductor Corporation
SKU: M4A3-384/192-12FANI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Lattice Semiconductor Corporation M4A3-384/192-12FANI

Part No.:: M4A3-384/192-12FANI

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-BGA

Datasheet:: M4A3-384/192-12FANI.pdf

Description:: IC CPLD 384MC 12NS 256FBGA

In Stock:: 2589

Quantity:: Add To Cart

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M4A3-384/192-12FANI Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
ispMACH® 4A
ProductStatus:
Not For New Designs
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
12 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
-
NumberofMacrocells:
384
NumberofGates:
-
NumberofI/O:
192
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

M4A3-384/192-12FANI this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including M4A3-384/192-12FANI price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for M4A3-384/192-12FANI to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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M4A3-384/192-12FANI information

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Common technical challenges and solutions when using M4A3-384/192-12FANI

M4A3-384/192-12FANI is a specialized FPGA chip commonly used in high-performance signal processing applications. It offers a large number of programmable logic elements and dedicated DSP blocks, making it suitable for tasks such as image processing, audio filtering, and communication signal modulation.

Noise Issues:

To mitigate noise issues when using M4A3-384/192-12FANI, careful PCB layout design is crucial. Separating analog and digital sections, utilizing ground planes, and placing decoupling capacitors near power pins can help minimize noise interference. Additionally, implementing proper signal shielding techniques and using low-noise power supplies contribute to noise reduction.

Power Consumption:

To address power consumption challenges associated with M4A3-384/192-12FANI, optimizing the FPGA design for low-power operation is essential. This includes utilizing power-saving features provided by the FPGA vendor, such as clock gating, power gating, and dynamic voltage and frequency scaling. Furthermore, implementing efficient algorithms and data processing techniques can reduce computational requirements and, consequently, power consumption.

Integration Complexity:

Dealing with the integration complexity of M4A3-384/192-12FANI involves careful system-level design and modularization. Breaking down the overall system into smaller, manageable modules simplifies integration and debugging. Utilizing standardized communication protocols, such as SPI or I2C, for interfacing with external components reduces complexity and enhances compatibility. Additionally, leveraging FPGA development tools and IP cores can streamline design and integration processes.

Heat Dissipation:

To manage heat dissipation in systems utilizing M4A3-384/192-12FANI, efficient thermal management strategies are necessary. This includes proper heat sinking, thermal vias, and airflow design to dissipate heat generated by the FPGA and associated components. Thermal simulations and analysis during the design phase help identify potential hotspots and optimize heat dissipation solutions accordingly.

Performance Optimization:

To optimize performance with M4A3-384/192-12FANI, leveraging parallel processing capabilities and hardware acceleration features of the FPGA is essential. Implementing optimized algorithms tailored to the FPGA architecture maximizes computational efficiency. Additionally, profiling and benchmarking the design help identify bottlenecks and areas for optimization, leading to improved overall system performance.

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6. What is the process for return or replacement of M4A3-384/192-12FANI?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of M4A3-384/192-12FANI.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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