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Name: M4A3-256/192-12FAI
Brand: Lattice Semiconductor Corporation
SKU: M4A3-256/192-12FAI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation M4A3-256/192-12FAI

Part No.:: M4A3-256/192-12FAI

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-BGA

Datasheet:: M4A3-256/192-12FAI.pdf

Description:: IC CPLD 256MC 12NS 256FBGA

In Stock:: 3488

Quantity:: Add To Cart

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M4A3-256/192-12FAI Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
ispMACH® 4A
ProductStatus:
Obsolete
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
12 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
-
NumberofMacrocells:
256
NumberofGates:
-
NumberofI/O:
192
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

M4A3-256/192-12FAI this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including M4A3-256/192-12FAI price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for M4A3-256/192-12FAI to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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M4A3-256/192-12FAI information

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Common technical challenges and solutions when using M4A3-256/192-12FAI

M4A3-256/192-12FAI is a field-programmable gate array (FPGA) device commonly used in high-performance computing and signal processing applications. It offers a large number of programmable logic elements, embedded memory blocks, and specialized DSP slices, making it suitable for a wide range of tasks.

Noise Challenges:

To mitigate noise issues in M4A3-256/192-12FAI designs, consider implementing proper grounding techniques and signal integrity measures. Utilize differential signaling and shielding for critical high-speed interfaces to minimize noise susceptibility. Additionally, carefully design power distribution networks and utilize decoupling capacitors to suppress power-related noise.

Power Consumption:

To address power consumption concerns with M4A3-256/192-12FAI, optimize the design for low-power operation by utilizing power-saving features available in the FPGA architecture. Implement dynamic voltage and frequency scaling techniques to adjust power consumption based on workload demands. Furthermore, optimize algorithms and logic designs to minimize switching activity and idle power consumption.

Integration Complexity:

Managing integration complexity with M4A3-256/192-12FAI involves careful system architecture planning and partitioning. Utilize hierarchical design methodologies to break down complex designs into manageable modules. Employ standardized interfaces and communication protocols to facilitate integration with other system components. Additionally, leverage IP cores and reusable design blocks to streamline development and reduce integration efforts.

Temperature Management:

To ensure reliable operation of M4A3-256/192-12FAI under varying temperature conditions, implement effective thermal management strategies. Utilize heat sinks, thermal vias, and fans to dissipate heat generated during operation. Monitor FPGA temperature using onboard sensors and implement dynamic thermal throttling mechanisms to prevent overheating. Additionally, optimize placement and routing of critical signals to minimize thermal coupling effects.

Timing Closure:

Achieving timing closure in M4A3-256/192-12FAI designs requires careful attention to timing constraints and optimization techniques. Utilize advanced synthesis and place-and-route tools to analyze and optimize timing paths. Implement pipelining and register retiming to balance critical path delays and meet timing requirements. Additionally, consider adjusting design constraints and trade-offs to achieve a balance between performance and timing closure.

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6. What is the process for return or replacement of M4A3-256/192-12FAI?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of M4A3-256/192-12FAI.

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