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Name: M4A3-256/192-10FANC
Brand: Lattice Semiconductor Corporation
SKU: M4A3-256/192-10FANC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Lattice Semiconductor Corporation M4A3-256/192-10FANC

Part No.:: M4A3-256/192-10FANC

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-BGA

Datasheet:: M4A3-256/192-10FANC.pdf

Description:: IC CPLD 256MC 10NS 256FBGA

In Stock:: 2794

Quantity:: Add To Cart

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M4A3-256/192-10FANC Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
ispMACH® 4A
ProductStatus:
Not For New Designs
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
10 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
-
NumberofMacrocells:
256
NumberofGates:
-
NumberofI/O:
192
OperatingTemperature:
0°C ~ 70°C (TA)
MountingType:
Surface Mount

M4A3-256/192-10FANC this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including M4A3-256/192-10FANC price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for M4A3-256/192-10FANC to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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M4A3-256/192-10FANC information

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Common technical challenges and solutions when using M4A3-256/192-10FANC

M4A3-256/192-10FANC is a high-performance FPGA device commonly used in signal processing and digital communication systems. It offers a large number of configurable logic elements (LEs) and embedded memory blocks, making it suitable for a wide range of applications.

Noise Challenges:

One common challenge when utilizing M4A3-256/192-10FANC is managing noise in the system. This can arise from various sources such as power supply fluctuations, signal coupling, or electromagnetic interference (EMI). To mitigate noise issues, proper grounding techniques, shielding, and filtering components should be employed in the circuit design. Additionally, careful routing of high-speed signals and separating noisy components from sensitive ones on the PCB layout can help reduce noise coupling.

Power Consumption:

Another significant concern is the power consumption of M4A3-256/192-10FANC. Given its high logic density and complex functionality, it can consume considerable power, especially when operating at high clock frequencies. To address this, power optimization techniques such as clock gating, power gating, and dynamic voltage and frequency scaling (DVFS) can be implemented in the FPGA design. By selectively disabling power to unused logic sections and adjusting voltage and frequency dynamically based on workload, overall power consumption can be reduced without compromising performance.

Integration Complexity:

Integrating M4A3-256/192-10FANC into a larger system can present challenges due to its complexity. Interfacing with other components, managing data flows, and ensuring compatibility with existing infrastructure require careful planning and design. One approach to simplify integration is to utilize standardized communication protocols and interfaces, such as PCIe, Ethernet, or UART, to enable seamless communication between the FPGA and other system components. Additionally, modularizing the FPGA design into smaller, reusable blocks can facilitate easier integration and debugging.

Temperature Management:

Effective temperature management is crucial for ensuring the reliability and longevity of M4A3-256/192-10FANC. The FPGA can generate significant heat during operation, which can degrade performance and reliability if not properly managed. Employing thermal management techniques such as heat sinks, fans, or even liquid cooling systems can help dissipate heat and maintain the FPGA within its specified operating temperature range. Moreover, monitoring the temperature of the device through embedded sensors and implementing dynamic thermal throttling mechanisms can prevent overheating and potential damage.

Signal Integrity:

Maintaining signal integrity is paramount in M4A3-256/192-10FANC-based systems, especially in high-speed data transmission applications. Signal integrity issues such as reflections, crosstalk, and jitter can degrade system performance and reliability. To address this, designers should pay close attention to transmission line design, impedance matching, and signal termination techniques. Using high-quality PCB materials with controlled impedance traces and minimizing signal path lengths can help preserve signal integrity and ensure robust communication within the FPGA system.

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6. What is the process for return or replacement of M4A3-256/192-10FANC?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the M4A3-256/192-10FANC we delivered, we will accept the replacement or return of the M4A3-256/192-10FANC only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of M4A3-256/192-10FANC.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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