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Name: M4A3-256/128-12FAI
Brand: Lattice Semiconductor Corporation
SKU: M4A3-256/128-12FAI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation M4A3-256/128-12FAI

Part No.:: M4A3-256/128-12FAI

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-BGA

Datasheet:: M4A3-256/128-12FAI.pdf

Description:: IC CPLD 256MC 12NS 256FBGA

In Stock:: 2834

Quantity:: Add To Cart

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M4A3-256/128-12FAI Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
ispMACH® 4A
ProductStatus:
Obsolete
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
12 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
-
NumberofMacrocells:
256
NumberofGates:
-
NumberofI/O:
128
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

M4A3-256/128-12FAI this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including M4A3-256/128-12FAI price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for M4A3-256/128-12FAI to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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M4A3-256/128-12FAI information

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Common technical challenges and solutions when using M4A3-256/128-12FAI

M4A3-256/128-12FAI is a high-capacity field-programmable gate array (FPGA) widely used in various applications, including telecommunications, aerospace, and industrial automation. It offers immense flexibility and computational power but comes with several technical challenges that need to be addressed for optimal performance and reliability.

Noise Issues:

One common challenge with M4A3-256/128-12FAI is noise interference, which can degrade signal integrity and affect system operation. To mitigate this, designers should employ proper grounding techniques, signal isolation methods, and noise filtering components like capacitors and ferrite beads. Additionally, optimizing clock distribution and layout design can minimize noise susceptibility.

Power Consumption:

Another significant concern is power consumption, especially in battery-operated or energy-efficient systems. Techniques such as clock gating, power gating, and dynamic voltage and frequency scaling (DVFS) can be implemented to reduce power usage during idle or low-demand periods. Moreover, optimizing the FPGA configuration and implementing efficient algorithms can further enhance energy efficiency.

Integration Complexity:

The complexity of integrating M4A3-256/128-12FAI into a larger system can pose challenges in terms of design complexity, resource allocation, and compatibility issues. Utilizing modular design practices, such as IP core reuse and hierarchical partitioning, can simplify integration efforts and promote reusability. Additionally, leveraging advanced design tools with built-in verification and validation capabilities can streamline the integration process and reduce time-to-market.

Clock Management:

Effective clock management is crucial for ensuring proper operation and synchronization within M4A3-256/128-12FAI-based systems. Designers should carefully plan clock domains, optimize clock distribution networks, and employ techniques like clock domain crossing (CDC) analysis to prevent timing violations and ensure reliable performance. Furthermore, utilizing clock conditioning circuits and PLLs (Phase-Locked Loops) can help achieve precise clocking requirements and minimize jitter.

Thermal Management:

Thermal issues can arise due to the high computational density and power dissipation of M4A3-256/128-12FAI, leading to performance degradation and reliability concerns. To address this, designers should implement effective thermal management strategies, such as heat sinks, thermal vias, and thermal simulation tools, to dissipate heat efficiently and maintain optimal operating temperatures. Additionally, monitoring techniques and thermal shutdown mechanisms can safeguard the FPGA against overheating and prevent thermal-induced failures.

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

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