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Name: M4A3-256/128-10YNI
Brand: Lattice Semiconductor Corporation
SKU: M4A3-256/128-10YNI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation M4A3-256/128-10YNI

Part No.:: M4A3-256/128-10YNI

Manufacturer:: Lattice Semiconductor Corporation

Package:: 208-BFQFP

Datasheet:: M4A3-256/128-10YNI.pdf

Description:: IC CPLD 256MC 10NS 208QFP

In Stock:: 2105

Quantity:: Add To Cart

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M4A3-256/128-10YNI Specifications

Package/Case:
208-BFQFP
Packaging:
Tray
Series:
ispMACH® 4A
ProductStatus:
Not For New Designs
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
10 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
-
NumberofMacrocells:
256
NumberofGates:
-
NumberofI/O:
128
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

M4A3-256/128-10YNI this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including M4A3-256/128-10YNI price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for M4A3-256/128-10YNI to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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M4A3-256/128-10YNI information

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Common technical challenges and solutions when using M4A3-256/128-10YNI

M4A3-256/128-10YNI is a high-density non-volatile memory module commonly used in embedded systems for data storage and retrieval. It offers significant storage capacity and fast access times, making it ideal for various applications.

Technical Challenges:

When using M4A3-256/128-10YNI, several technical challenges may arise, including:

1. Noise Issues: High-density memory modules like M4A3-256/128-10YNI can experience noise interference, affecting data integrity and system reliability. This can be addressed by implementing proper shielding and signal conditioning techniques.

2. Power Consumption: M4A3-256/128-10YNI modules may consume significant power during read and write operations, leading to increased energy consumption and thermal issues. Power management strategies such as dynamic voltage scaling and low-power modes can mitigate this challenge.

3. Integration Complexity: Integrating M4A3-256/128-10YNI into embedded systems can be complex due to its high-density nature and interface requirements. Careful design consideration and PCB layout optimization are necessary to ensure proper functioning and signal integrity.

Solutions and Improvements:

To address these challenges, the following solutions and improvements can be implemented:

1. Noise Mitigation: Utilize noise filtering components such as capacitors and ferrite beads near the M4A3-256/128-10YNI module to suppress electromagnetic interference. Ensure proper grounding and isolation techniques are employed to minimize noise coupling.

2. Power Optimization: Implement power-saving algorithms and techniques such as data prefetching, burst mode operations, and standby modes to reduce the overall power consumption of M4A3-256/128-10YNI. Additionally, use low-dropout voltage regulators and efficient power delivery networks to minimize voltage droops and power losses.

3. Integration Simplification: Simplify M4A3-256/128-10YNI integration by utilizing standardized memory interfaces and reference designs. Follow best practices for PCB layout, such as minimizing trace lengths and impedance mismatches, to ensure reliable data transmission and minimize signal degradation.

4. Temperature Management: Implement thermal management techniques such as heat sinks, thermal vias, and airflow optimization to prevent M4A3-256/128-10YNI from overheating during intensive read/write operations. Monitor temperature levels and implement dynamic clock throttling if necessary to maintain optimal operating conditions.

5. Testing and Validation: Conduct rigorous testing and validation procedures to verify the performance, reliability, and compatibility of M4A3-256/128-10YNI in the target embedded system. Perform stress testing under various operating conditions to identify potential issues and optimize system parameters accordingly.

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6. What is the process for return or replacement of M4A3-256/128-10YNI?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the M4A3-256/128-10YNI we delivered, we will accept the replacement or return of the M4A3-256/128-10YNI only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of M4A3-256/128-10YNI.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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