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Name: M4A3-256/128-10YC
Brand: Lattice Semiconductor Corporation
SKU: M4A3-256/128-10YC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation M4A3-256/128-10YC

Part No.:: M4A3-256/128-10YC

Manufacturer:: Lattice Semiconductor Corporation

Package:: 208-BFQFP

Datasheet:: M4A3-256/128-10YC.pdf

Description:: IC CPLD 256MC 10NS 208QFP

In Stock:: 3154

Quantity:: Add To Cart

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M4A3-256/128-10YC Specifications

Package/Case:
208-BFQFP
Packaging:
Tube
Series:
ispMACH® 4A
ProductStatus:
Obsolete
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
10 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
-
NumberofMacrocells:
256
NumberofGates:
-
NumberofI/O:
128
OperatingTemperature:
0°C ~ 70°C (TA)
MountingType:
Surface Mount

M4A3-256/128-10YC this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including M4A3-256/128-10YC price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for M4A3-256/128-10YC to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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M4A3-256/128-10YC information

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Common technical challenges and solutions when using M4A3-256/128-10YC

M4A3-256/128-10YC is a high-performance FPGA (Field-Programmable Gate Array) chip commonly used in embedded systems for various applications. It offers a large number of logic elements, versatile I/O capabilities, and flexible reconfiguration options.

Noise Issues:

To address noise issues in M4A3-256/128-10YC designs, careful PCB layout design is crucial. Proper placement of critical components, such as power regulators and high-speed signal traces, along with the use of decoupling capacitors, can help minimize noise interference. Additionally, implementing differential signaling and impedance matching techniques can mitigate noise-induced errors in communication interfaces.

Power Consumption:

Optimizing power consumption in M4A3-256/128-10YC designs requires a multi-faceted approach. Utilizing power gating techniques allows selective power-down of unused modules or peripherals, reducing overall power consumption. Furthermore, employing clock gating and dynamic voltage and frequency scaling (DVFS) techniques can dynamically adjust the clock frequency and supply voltage based on the system's performance requirements, effectively reducing power consumption during idle or low-utilization periods.

Integration Complexity:

Managing integration complexity in M4A3-256/128-10YC-based designs involves careful planning and modular design practices. Breaking down the system into smaller, manageable modules facilitates easier integration and debugging. Utilizing standardized communication protocols, such as AXI (Advanced eXtensible Interface), simplifies interconnectivity between different modules and peripherals. Additionally, leveraging IP (Intellectual Property) cores and pre-verified design blocks reduces development time and risk associated with complex functionality implementation.

Temperature Management:

Effective temperature management is essential for maintaining the reliability and performance of M4A3-256/128-10YC devices. Implementing thermal sensors and monitoring circuits enables real-time temperature monitoring, allowing the system to dynamically adjust operating parameters or activate thermal mitigation strategies, such as fan control or clock throttling, to prevent overheating. Moreover, optimizing airflow and heat dissipation within the system enclosure through proper ventilation and heat sinks helps dissipate excess heat generated during operation.

Signal Integrity:

Ensuring signal integrity in M4A3-256/128-10YC designs involves careful signal routing and impedance control. Employing controlled impedance traces and minimizing signal reflections reduces signal degradation and susceptibility to electromagnetic interference (EMI). Additionally, implementing signal integrity analysis tools during the design phase, such as eye diagram analysis and signal integrity simulation, helps identify and mitigate potential signal integrity issues early in the development cycle.

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6. What is the process for return or replacement of M4A3-256/128-10YC?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the M4A3-256/128-10YC we delivered, we will accept the replacement or return of the M4A3-256/128-10YC only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of M4A3-256/128-10YC.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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