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Name: M4A3-256/128-10FAI
Brand: Lattice Semiconductor Corporation
SKU: M4A3-256/128-10FAI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation M4A3-256/128-10FAI

Part No.:: M4A3-256/128-10FAI

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-BGA

Datasheet:: M4A3-256/128-10FAI.pdf

Description:: IC CPLD 256MC 10NS 256FBGA

In Stock:: 2704

Quantity:: Add To Cart

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M4A3-256/128-10FAI Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
ispMACH® 4A
ProductStatus:
Obsolete
ProgrammableType:
In System Programmable
DelayTimetpd(1)Max:
10 ns
VoltageSupply-Internal:
3V ~ 3.6V
NumberofLogicElements/Blocks:
-
NumberofMacrocells:
256
NumberofGates:
-
NumberofI/O:
128
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

M4A3-256/128-10FAI this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including M4A3-256/128-10FAI price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for M4A3-256/128-10FAI to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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M4A3-256/128-10FAI information

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Common technical challenges and solutions when using M4A3-256/128-10FAI

M4A3-256/128-10FAI is a field-programmable gate array (FPGA) device commonly used in high-performance computing and signal processing applications. It offers a large number of programmable logic cells, embedded memory blocks, and versatile I/O interfaces.

Noise Issues:

To mitigate noise issues in M4A3-256/128-10FAI designs, proper PCB layout techniques should be employed, including careful routing of high-speed signals, minimizing signal reflections, and utilizing ground and power planes effectively. Additionally, implementing differential signaling and using ferrite beads or bypass capacitors can help suppress electromagnetic interference (EMI) and reduce noise.

Power Consumption:

To address power consumption concerns in M4A3-256/128-10FAI designs, power-aware synthesis and optimization techniques can be employed during the design phase. This includes clock gating, power gating, and voltage scaling strategies to reduce dynamic and static power consumption. Furthermore, utilizing low-power design guidelines for FPGA logic implementation and optimizing clock tree synthesis can contribute to overall power efficiency.

Integration Complexity:

Managing integration complexity in M4A3-256/128-10FAI designs involves modular design practices and hierarchical design methodologies. Breaking down the system into smaller, manageable modules allows for easier verification, debugging, and scalability. Additionally, utilizing intellectual property (IP) cores and pre-verified functional blocks can simplify integration tasks and reduce design time. Adopting standardized communication protocols, such as AXI or PCIe, can facilitate seamless integration with other system components.

Thermal Management:

To address thermal challenges associated with M4A3-256/128-10FAI, proper thermal management techniques should be implemented. This includes designing efficient heat dissipation mechanisms such as heat sinks, thermal vias, and fans to maintain optimal operating temperatures. Thermal simulations and analysis can be conducted during the design phase to identify potential hot spots and optimize the FPGA placement and airflow within the system enclosure.

Reliability:

Ensuring reliability in M4A3-256/128-10FAI designs involves rigorous testing and validation procedures. This includes functional verification, timing analysis, and fault tolerance testing to ensure correct operation under varying environmental conditions and workload scenarios. Additionally, implementing built-in self-test (BIST) and error detection/correction mechanisms can enhance the reliability of the FPGA-based systems.

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6. What is the process for return or replacement of M4A3-256/128-10FAI?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

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