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Name: M2GL060TS-FGG676I
Brand: Microchip Technology
SKU: M2GL060TS-FGG676I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Microchip Technology M2GL060TS-FGG676I

Part No.:: M2GL060TS-FGG676I

Manufacturer:: Microchip Technology

Package:: 676-BGA

Datasheet:: M2GL060TS-FGG676I.pdf

Description:: IC FPGA 387 I/O 676FBGA

In Stock:: 2260

Quantity:: Add To Cart

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M2GL060TS-FGG676I Specifications

Package/Case:
676-BGA
Packaging:
Tray
Series:
IGLOO2
ProductStatus:
Active
NumberofLABs/CLBs:
-
NumberofLogicElements/Cells:
56520
TotalRAMBits:
1869824
NumberofI/O:
387
NumberofGates:
-
Voltage-Supply:
1.14V ~ 2.625V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

M2GL060TS-FGG676I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including M2GL060TS-FGG676I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for M2GL060TS-FGG676I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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M2GL060TS-FGG676I information

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M2GL060TS-FGG676I application case analysis in emerging technology fields

M2GL060TS-FGG676I is a field-programmable gate array (FPGA) device known for its high performance and versatility, making it suitable for a wide range of applications in various industries. It offers a large number of configurable logic blocks, embedded memory, and flexible I/O interfaces.

Application Scenario:

In the aerospace industry, M2GL060TS-FGG676I can be utilized for mission-critical tasks such as image processing, sensor data fusion, and communication protocol handling in satellite systems.

System Design:

To design a satellite payload processing system using M2GL060TS-FGG676I, follow these steps:

1. Sensor Data Acquisition:

Connect various sensors, such as cameras, spectrometers, and gyroscopes, to the FPGA's I/O pins. Implement appropriate signal conditioning and interface circuitry to ensure reliable data acquisition.

2. Image Processing:

Utilize the FPGA's configurable logic blocks to implement image processing algorithms for tasks like image enhancement, compression, and feature extraction. Maximize parallelism and resource utilization for efficient processing.

3. Data Fusion:

Integrate data fusion algorithms to combine information from multiple sensors and sources. Use the FPGA's embedded memory and arithmetic resources for real-time fusion of sensor data streams.

4. Communication:

Implement communication protocols such as SpaceWire or Ethernet using the FPGA's flexible I/O interfaces. Handle data transmission between the satellite payload system and ground stations or other satellite subsystems.

5. Power Management:

Design efficient power management circuitry to ensure the M2GL060TS-FGG676I and associated components operate within specified power budgets. Utilize power gating and dynamic voltage scaling techniques for power optimization.

Considerations:

When designing the satellite payload processing system, consider the following factors:

- Radiation Hardening: Implement mitigation techniques to harden the FPGA against radiation-induced errors and ensure reliable operation in the harsh space environment.

- Resource Optimization: Optimize the utilization of FPGA resources to maximize performance and minimize resource conflicts.

- Fault Tolerance: Implement fault detection and recovery mechanisms to mitigate the impact of single-event upsets or hardware faults on system operation.

- Thermal Management: Design effective thermal management solutions to dissipate heat generated by the M2GL060TS-FGG676I and prevent overheating in the satellite payload system.

- Compliance: Ensure compliance with industry standards and regulations for satellite systems, including reliability, safety, and interoperability standards.

M2GL060TS-FGG676I FAQ

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3. Are the M2GL060TS-FGG676I price and inventory displayed accurate?

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6. What is the process for return or replacement of M2GL060TS-FGG676I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the M2GL060TS-FGG676I we delivered, we will accept the replacement or return of the M2GL060TS-FGG676I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of M2GL060TS-FGG676I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations