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Name: M1A3P250-FGG144I
Brand: Microchip Technology
SKU: M1A3P250-FGG144I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Microchip Technology M1A3P250-FGG144I

Part No.:: M1A3P250-FGG144I

Manufacturer:: Microchip Technology

Package:: 144-LBGA

Datasheet:: M1A3P250-FGG144I.pdf

Description:: IC FPGA 97 I/O 144FBGA

In Stock:: 3952

Quantity:: Add To Cart

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M1A3P250-FGG144I Specifications

Package/Case:
144-LBGA
Packaging:
Tray
Series:
ProASIC3
ProductStatus:
Active
NumberofLABs/CLBs:
-
NumberofLogicElements/Cells:
-
TotalRAMBits:
36864
NumberofI/O:
97
NumberofGates:
250000
Voltage-Supply:
1.425V ~ 1.575V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

M1A3P250-FGG144I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including M1A3P250-FGG144I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for M1A3P250-FGG144I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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M1A3P250-FGG144I information

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M1A3P250-FGG144I performance and reliability evaluation in extreme environments

M1A3P250-FGG144I is a high-performance field-programmable gate array (FPGA) designed for demanding applications in extreme environments. It offers a versatile platform for implementing complex digital logic and signal processing algorithms, making it ideal for aerospace, defense, and industrial applications where reliability and performance are critical.

Environmental Considerations:

In the design of M1A3P250-FGG144I, several environmental factors are carefully considered to ensure robust operation in extreme conditions:

1. Temperature: The FPGA is designed to operate reliably over a wide temperature range, from extreme cold to high heat. Specialized materials and thermal management techniques are employed to dissipate heat efficiently and maintain optimal operating temperatures.

2. Humidity: The device is engineered to withstand high levels of humidity without compromising performance or reliability. Moisture-resistant packaging and conformal coatings protect sensitive components from moisture ingress, ensuring long-term stability.

3. Vibration and Shock: M1A3P250-FGG144I is built to withstand mechanical shocks and vibrations encountered in harsh environments, such as aerospace and automotive applications. Robust packaging and secure mounting techniques ensure the integrity of internal components during operation.

4. Radiation: For aerospace and defense applications, the FPGA is radiation-hardened to withstand ionizing radiation effects, including single-event upsets (SEUs) and total ionizing dose (TID) effects. Radiation-hardening techniques, such as triple modular redundancy (TMR) and hardened flip-flops, enhance the device's resilience in radiation-rich environments.

Performance in Practical Applications:

M1A3P250-FGG144I has demonstrated exceptional performance and reliability in various real-world applications:

1. Aerospace: In space missions, the FPGA has been deployed in satellite communication systems, onboard processing units, and spacecraft control systems, where it operates reliably in the vacuum of space and withstands exposure to cosmic radiation.

2. Defense: Military-grade versions of M1A3P250-FGG144I are utilized in ruggedized electronic warfare systems, radar signal processing units, and avionics control systems, where they endure harsh environmental conditions, including extreme temperatures and mechanical shocks.

3. Industrial: In industrial automation and control systems, the FPGA serves as a central processing unit for real-time monitoring, data acquisition, and control tasks in environments with temperature extremes, humidity fluctuations, and electromagnetic interference.

Conclusion:

M1A3P250-FGG144I excels in extreme environments due to its robust design, advanced thermal management, and radiation-hardened features. Its exceptional performance and reliability make it a preferred choice for mission-critical applications where failure is not an option.

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6. What is the process for return or replacement of M1A3P250-FGG144I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the M1A3P250-FGG144I we delivered, we will accept the replacement or return of the M1A3P250-FGG144I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of M1A3P250-FGG144I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations