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Name: LFEC3E-4FN256C
Brand: Lattice Semiconductor Corporation
SKU: LFEC3E-4FN256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LFEC3E-4FN256C

Part No.:: LFEC3E-4FN256C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-BGA

Datasheet:: LFEC3E-4FN256C.pdf

Description:: IC FPGA 160 I/O 256FBGA

In Stock:: 145

Quantity:: Add To Cart

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LFEC3E-4FN256C Specifications

Package/Case:
256-BGA
Packaging:
Tray
Series:
EC
ProductStatus:
Obsolete
NumberofLABs/CLBs:
-
NumberofLogicElements/Cells:
3100
TotalRAMBits:
56320
NumberofI/O:
160
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

LFEC3E-4FN256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LFEC3E-4FN256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LFEC3E-4FN256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LFEC3E-4FN256C information

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LFEC3E-4FN256C performance and reliability evaluation in extreme environments

LFEC3E-4FN256C is a Field-Programmable Gate Array (FPGA) device designed by Lattice Semiconductor, offering high performance and reliability for a wide range of applications. Its robust architecture and advanced features make it suitable for deployment in extreme environmental conditions.

Environmental Considerations:

When designing LFEC3E-4FN256C-based systems for extreme environments, several environmental factors need to be considered:

- Temperature: LFEC3E-4FN256C is designed to operate reliably across a wide temperature range, from -40°C to 125°C. This temperature resilience ensures its suitability for applications exposed to harsh climatic conditions, such as automotive, aerospace, and industrial settings.

- Humidity: The device's packaging and construction are engineered to withstand high humidity levels without compromising performance or reliability. This resilience is crucial for applications deployed in humid environments, such as outdoor industrial monitoring systems.

- Vibration and Shock: LFEC3E-4FN256C is built to endure mechanical stresses, including vibration and shock, making it ideal for use in ruggedized equipment like military electronics and automotive control systems.

- Chemical Exposure: The device's encapsulation and materials are chosen to resist chemical exposure, enhancing its reliability in environments where exposure to corrosive substances is a concern, such as chemical processing plants.

- Radiation: For applications exposed to radiation, such as space exploration and nuclear facilities, LFEC3E-4FN256C offers radiation-hardened versions with enhanced immunity to radiation-induced errors.

Performance Analysis:

Despite extreme environmental conditions, LFEC3E-4FN256C maintains its performance and reliability through several key features:

- Robust Architecture: The FPGA's architecture is designed to mitigate the effects of environmental stressors, ensuring consistent operation and predictable behavior.

- Thermal Management: Efficient thermal management techniques, such as heat sinks and thermal vias, help dissipate heat and maintain optimal operating temperatures, even in high-temperature environments.

- Reliability Testing: Prior to deployment, LFEC3E-4FN256C undergoes rigorous reliability testing, including temperature cycling, humidity testing, and accelerated aging, to ensure its resilience in harsh conditions.

- Failure Mitigation: Built-in redundancy and fault-tolerant mechanisms help mitigate the impact of environmental stressors on device performance, enhancing overall system reliability.

Conclusion:

In conclusion, LFEC3E-4FN256C demonstrates exceptional performance and reliability in extreme environmental conditions, making it a preferred choice for applications demanding robustness and resilience. By considering various environmental factors during design and leveraging the FPGA's advanced features, engineers can develop robust systems capable of withstanding the harshest operating conditions.

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3. Are the LFEC3E-4FN256C price and inventory displayed accurate?

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6. What is the process for return or replacement of LFEC3E-4FN256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LFEC3E-4FN256C we delivered, we will accept the replacement or return of the LFEC3E-4FN256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LFEC3E-4FN256C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations