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Name: LFE5UM-25F-6BG381C
Brand: Lattice Semiconductor Corporation
SKU: LFE5UM-25F-6BG381C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LFE5UM-25F-6BG381C

Part No.:: LFE5UM-25F-6BG381C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 381-FBGA

Datasheet:: LFE5UM-25F-6BG381C.pdf

Description:: IC FPGA 197 I/O 381CABGA

In Stock:: 2323

Quantity:: Add To Cart

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LFE5UM-25F-6BG381C Specifications

Package/Case:
381-FBGA
Packaging:
Tray
Series:
ECP5
ProductStatus:
Active
NumberofLABs/CLBs:
6000
NumberofLogicElements/Cells:
24000
TotalRAMBits:
1032192
NumberofI/O:
197
NumberofGates:
-
Voltage-Supply:
1.045V ~ 1.155V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

LFE5UM-25F-6BG381C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LFE5UM-25F-6BG381C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LFE5UM-25F-6BG381C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LFE5UM-25F-6BG381C information

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LFE5UM-25F-6BG381C performance and reliability evaluation in extreme environments

LFE5UM-25F-6BG381C is a field-programmable gate array (FPGA) device designed by Lattice Semiconductor Corporation. It offers high performance, low power consumption, and advanced features suitable for a wide range of applications, including those operating in extreme environmental conditions.

Environmental Considerations:

When designing with LFE5UM-25F-6BG381C for extreme environments, several environmental factors need to be considered:

1. Temperature: The device should be capable of operating reliably over a wide temperature range, from extreme cold to high heat. Proper thermal management techniques, such as heat sinks or fans, may be necessary to ensure the device stays within its specified operating temperature range.

2. Humidity: Moisture can potentially damage electronic components, including FPGAs. Designers need to consider humidity sealing and conformal coating to protect LFE5UM-25F-6BG381C from moisture ingress.

3. Shock and Vibration: In applications subject to shock and vibration, such as aerospace or automotive, the device packaging and mounting must be robust to withstand these conditions without compromising performance or reliability.

Performance Analysis:

Despite challenging environmental conditions, LFE5UM-25F-6BG381C demonstrates remarkable performance and reliability in practical applications. Here are some key observations:

1. Thermal Management: Through effective thermal management techniques, such as heat sinking and airflow optimization, LFE5UM-25F-6BG381C maintains stable performance even in high-temperature environments, ensuring reliable operation over extended periods.

2. Environmental Sealing: Proper sealing measures protect the device from moisture and contaminants, safeguarding its functionality and extending its lifespan, particularly in humid or corrosive environments.

3. Mechanical Durability: The robust packaging and mounting options available for LFE5UM-25F-6BG381C ensure it can withstand mechanical shocks and vibrations, making it suitable for applications with stringent durability requirements.

4. Reliability Testing: Extensive reliability testing, including temperature cycling, humidity testing, and shock/vibration testing, validates the device's performance under various environmental conditions, instilling confidence in its reliability for mission-critical applications.

Conclusion:

In conclusion, LFE5UM-25F-6BG381C exhibits exceptional performance and reliability in extreme environmental conditions, thanks to its robust design, effective thermal management, and comprehensive testing. Whether deployed in aerospace, automotive, or industrial applications, this FPGA device proves its resilience and versatility, meeting the demands of the most challenging operating environments.

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6. What is the process for return or replacement of LFE5UM-25F-6BG381C?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LFE5UM-25F-6BG381C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations