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Name: LFE3-35EA-6FN484C
Brand: Lattice Semiconductor Corporation
SKU: LFE3-35EA-6FN484C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LFE3-35EA-6FN484C

Part No.:: LFE3-35EA-6FN484C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 484-BBGA

Datasheet:: LFE3-35EA-6FN484C.pdf

Description:: IC FPGA 295 I/O 484FBGA

In Stock:: 3290

Quantity:: Add To Cart

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LFE3-35EA-6FN484C Specifications

Package/Case:
484-BBGA
Packaging:
Tray
Series:
ECP3
ProductStatus:
Active
NumberofLABs/CLBs:
4125
NumberofLogicElements/Cells:
33000
TotalRAMBits:
1358848
NumberofI/O:
295
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

LFE3-35EA-6FN484C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LFE3-35EA-6FN484C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LFE3-35EA-6FN484C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LFE3-35EA-6FN484C information

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LFE3-35EA-6FN484C performance and reliability evaluation in extreme environments

LFE3-35EA-6FN484C is a high-performance FPGA chip designed by Lattice Semiconductor, offering versatility and reliability for a wide range of applications, including those operating in extreme environmental conditions.

Environmental Considerations:

In the design of LFE3-35EA-6FN484C-based systems for extreme environments, several environmental factors need to be carefully considered:

- Temperature: The LFE3-35EA-6FN484C FPGA is engineered to operate reliably across a wide temperature range, from -40°C to 100°C, making it suitable for applications in both hot and cold environments. Advanced thermal management techniques, such as heat sinks or fans, may be employed to ensure optimal performance under high-temperature conditions.

- Humidity: Moisture can affect the performance and reliability of electronic components, including FPGAs. The LFE3-35EA-6FN484C chip is designed with moisture-resistant packaging and conformal coating options to protect against humidity-induced failures, making it suitable for deployment in humid environments such as tropical climates or industrial settings.

- Vibration and Shock: In applications subject to vibration or shock, such as automotive or aerospace systems, the LFE3-35EA-6FN484C FPGA's robust construction and solder ball grid array (SBGA) packaging ensure mechanical durability and resistance to physical stress, minimizing the risk of solder joint failures or component dislodgment.

- Radiation: For applications in radiation-rich environments, such as space missions or nuclear facilities, radiation-hardened versions of the LFE3-35EA-6FN484C FPGA are available with enhanced radiation tolerance, mitigating the effects of ionizing radiation on device performance and reliability.

Performance Analysis:

In practical applications, the LFE3-35EA-6FN484C FPGA demonstrates exceptional performance and reliability even in the most challenging environmental conditions. Its advanced features, including low-power consumption, high-speed interfaces, and extensive logic resources, enable the implementation of complex digital designs with precision and efficiency.

- High-Temperature Performance: Through rigorous testing and characterization, the LFE3-35EA-6FN484C FPGA has been proven to maintain stable operation and functionality at elevated temperatures, ensuring uninterrupted performance in hot environments such as industrial ovens or automotive engine compartments.

- Low-Temperature Reliability: The LFE3-35EA-6FN484C chip's robust design and low-power architecture enable reliable operation even in freezing conditions, making it suitable for outdoor applications in cold climates or aerospace systems exposed to sub-zero temperatures.

- Environmental Testing: Prior to deployment, LFE3-35EA-6FN484C-based systems undergo extensive environmental testing, including thermal cycling, humidity exposure, and mechanical shock, to validate performance and reliability under real-world operating conditions.

- Field Deployment: In diverse industries such as automotive, aerospace, and industrial automation, LFE3-35EA-6FN484C FPGAs have been successfully deployed in mission-critical systems, demonstrating their resilience and longevity in extreme environments.

Conclusion:

The LFE3-35EA-6FN484C FPGA's robust design, wide operating temperature range, and advanced reliability features make it an ideal choice for applications requiring high-performance computing in extreme environmental conditions. From automotive electronics to aerospace avionics, this versatile FPGA delivers unparalleled performance and durability, ensuring the success of mission-critical systems in the harshest of environments.

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6. What is the process for return or replacement of LFE3-35EA-6FN484C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LFE3-35EA-6FN484C we delivered, we will accept the replacement or return of the LFE3-35EA-6FN484C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LFE3-35EA-6FN484C.

(3)The PartNo is unused and only in the original unpacked packaging.

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