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Name: LCMXO640E-4BN256I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO640E-4BN256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO640E-4BN256I

Part No.:: LCMXO640E-4BN256I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LFBGA, CSPBGA

Datasheet:: LCMXO640E-4BN256I.pdf

Description:: IC FPGA 159 I/O 256CABGA

In Stock:: 3660

Quantity:: Add To Cart

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LCMXO640E-4BN256I Specifications

Package/Case:
256-LFBGA, CSPBGA
Packaging:
Tray
Series:
MachXO
ProductStatus:
Active
NumberofLABs/CLBs:
80
NumberofLogicElements/Cells:
640
TotalRAMBits:
-
NumberofI/O:
159
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

LCMXO640E-4BN256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO640E-4BN256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO640E-4BN256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO640E-4BN256I information

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LCMXO640E-4BN256I performance and reliability evaluation in extreme environments

LCMXO640E-4BN256I is a Field-Programmable Gate Array (FPGA) chip known for its versatility and reliability in extreme environmental conditions. This article explores its performance and reliability assessment in such harsh environments, considering factors like high temperature, low temperature, humidity, etc.

Environmental Considerations in Design:

Incorporating LCMXO640E-4BN256I into system designs for extreme environments requires careful consideration of environmental factors. Designers must account for:

- Temperature: The FPGA's operating temperature range and thermal management solutions to ensure proper functionality in both high and low-temperature conditions.

- Humidity: Protection against moisture and humidity to prevent corrosion and electrical malfunctions.

- Shock and Vibration: Mechanical ruggedization to withstand shocks and vibrations commonly encountered in harsh environments.

- Radiation: Shielding or radiation-hardening techniques to mitigate the effects of ionizing radiation in aerospace or nuclear applications.

Performance in Practical Applications:

LCMXO640E-4BN256I has demonstrated exceptional performance in various real-world applications despite extreme environmental challenges. Examples include:

- Aerospace: Serving as a vital component in satellite systems where it operates reliably in the vacuum of space and withstands cosmic radiation.

- Industrial Automation: Powering control systems in manufacturing plants where it endures high temperatures, humidity, and mechanical stress without compromising performance.

- Automotive: Integrating into automotive electronics for engine control units (ECUs) and advanced driver-assistance systems (ADAS) where it withstands temperature fluctuations and vibrations.

- Military: Deployed in military-grade equipment for communication, radar, and surveillance applications, proving its resilience in extreme temperatures and harsh environments.

Reliability Assessment:

To ensure the reliability of LCMXO640E-4BN256I in extreme environments, thorough testing and validation procedures are essential. This includes:

- Environmental Testing: Subjecting the FPGA to temperature chambers, humidity chambers, and vibration tables to simulate real-world conditions and assess its performance.

- Accelerated Aging Tests: Evaluating the FPGA's long-term reliability by exposing it to accelerated stress factors like high temperature and voltage to predict its lifespan.

- Failure Analysis: Investigating any failures to identify weak points in the design or manufacturing process and improve overall reliability.

Conclusion:

LCMXO640E-4BN256I stands as a robust FPGA solution capable of thriving in extreme environmental conditions. Its resilience, combined with careful design considerations and rigorous testing, ensures reliable performance across a wide range of applications, from aerospace to industrial automation and beyond.

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

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