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Name: LCMXO640C-3BN256I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO640C-3BN256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO640C-3BN256I

Part No.:: LCMXO640C-3BN256I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LFBGA, CSPBGA

Datasheet:: LCMXO640C-3BN256I.pdf

Description:: IC FPGA 159 I/O 256CABGA

In Stock:: 2759

Quantity:: Add To Cart

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LCMXO640C-3BN256I Specifications

Package/Case:
256-LFBGA, CSPBGA
Packaging:
Tray
Series:
MachXO
ProductStatus:
Active
NumberofLABs/CLBs:
80
NumberofLogicElements/Cells:
640
TotalRAMBits:
-
NumberofI/O:
159
NumberofGates:
-
Voltage-Supply:
1.71V ~ 3.465V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

LCMXO640C-3BN256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO640C-3BN256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO640C-3BN256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO640C-3BN256I information

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LCMXO640C-3BN256I performance and reliability evaluation in extreme environments

LCMXO640C-3BN256I is a low-cost, low-power FPGA (Field-Programmable Gate Array) device manufactured by Lattice Semiconductor. It offers a versatile platform for implementing various digital designs in applications ranging from consumer electronics to industrial control systems.

Environmental Considerations:

In the design of LCMXO640C-3BN256I-based systems, several environmental factors must be considered to ensure reliable operation in extreme conditions:

- Temperature: The FPGA must be capable of functioning within a wide temperature range, from extreme cold to high heat. Thermal management techniques, such as heat sinks or fans, may be employed to mitigate temperature-related issues.

- Humidity: Moisture can degrade the performance and reliability of electronic components. Proper encapsulation and conformal coating techniques may be used to protect the LCMXO640C-3BN256I from humidity-induced damage.

- Vibration and Shock: In applications subject to mechanical stress, such as automotive or aerospace systems, the FPGA package must withstand vibrations and shocks without compromising functionality. Secure mounting and ruggedized packaging can enhance resilience.

- Radiation: In environments with radiation exposure, such as space or medical applications, radiation-hardened designs may be necessary to prevent configuration errors or data corruption in the LCMXO640C-3BN256I.

- Electromagnetic Interference (EMI): To ensure electromagnetic compatibility (EMC) and minimize EMI emissions, proper signal routing, shielding, and filtering techniques should be implemented in the FPGA-based system.

Performance Analysis:

In real-world applications, LCMXO640C-3BN256I demonstrates robust performance and reliability even in challenging environments. For instance, in automotive electronics, it can be utilized for tasks such as motor control, sensor interfacing, and onboard diagnostics.

- Motor Control: The FPGA's configurable logic allows for precise control of motors, enabling smooth operation across varying speeds and loads.

- Sensor Interfacing: With its abundant I/O resources, the LCMXO640C-3BN256I facilitates seamless integration with various sensors for monitoring environmental parameters or vehicle conditions.

- Onboard Diagnostics: The FPGA can implement diagnostic routines to detect faults or abnormalities in the vehicle's systems, contributing to enhanced safety and reliability.

Conclusion:

LCMXO640C-3BN256I offers a compelling solution for demanding applications requiring reliability, performance, and adaptability in extreme environments. By addressing environmental factors during design and leveraging the FPGA's capabilities, developers can create robust systems that excel even in the harshest conditions.

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6. What is the process for return or replacement of LCMXO640C-3BN256I?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

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(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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