LCMXO3LF-6900C-6BG400I

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Lattice Semiconductor Corporation LCMXO3LF-6900C-6BG400I

HIGH-RELIABILITY-COMPONENTS
Part No.:
LCMXO3LF-6900C-6BG400I
Manufacturer:
Lattice Semiconductor Corporation
Package:
400-LFBGA
Datasheet:
LCMXO3LF-6900C-6BG400I.pdf
Description:
IC FPGA 335 I/O 400CABGA
In Stock:
2426
Quantity:
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  • Purchase and inquiryPurchase and inquiry

    LCMXO3LF-6900C-6BG400I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO3LF-6900C-6BG400I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO3LF-6900C-6BG400I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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    LCMXO3LF-6900C-6BG400I informationLCMXO3LF-6900C-6BG400I information

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    LCMXO3LF-6900C-6BG400I performance and reliability evaluation in extreme environments


    LCMXO3LF-6900C-6BG400I is a field-programmable gate array (FPGA) manufactured by Lattice Semiconductor, designed for high-performance and low-power applications. It offers a versatile platform for implementing custom logic functions and signal processing algorithms in a wide range of applications, including aerospace, automotive, industrial automation, and telecommunications.

    Environmental Considerations:

    In extreme environmental conditions, such as high temperature, low temperature, and high humidity, the LCMXO3LF-6900C-6BG400I FPGA must demonstrate reliable performance to ensure the proper operation of the systems it is integrated into. During the design phase, several factors are considered to address these environmental challenges:

    - Temperature Tolerance: The LCMXO3LF-6900C-6BG400I FPGA is designed to operate over a wide temperature range, typically from -40°C to 125°C. This temperature tolerance allows it to withstand both extreme cold and heat conditions encountered in various environments, including automotive and aerospace applications.

    - Thermal Management: Adequate thermal management techniques, such as heat sinks, thermal vias, and airflow design, are employed to dissipate heat generated during FPGA operation, especially in high-temperature environments. Efficient thermal management ensures reliable long-term operation and prevents overheating-induced failures.

    - Humidity Resistance: The LCMXO3LF-6900C-6BG400I FPGA is built to withstand high humidity levels encountered in industrial and outdoor environments. Conformal coating and sealing techniques are utilized to protect the FPGA and its surrounding components from moisture ingress, ensuring reliable performance even in humid conditions.

    - Shock and Vibration Resistance: For applications subject to mechanical shocks and vibrations, such as automotive and aerospace systems, the LCMXO3LF-6900C-6BG400I FPGA is designed with robust packaging and mounting techniques to withstand these stresses and maintain electrical connectivity.

    - Radiation Hardening: In radiation-intensive environments, such as space applications, the LCMXO3LF-6900C-6BG400I FPGA may undergo radiation hardening techniques to mitigate the effects of ionizing radiation, ensuring reliable operation in harsh radiation environments.

    Performance Analysis:

    In practical applications, the LCMXO3LF-6900C-6BG400I FPGA demonstrates robust performance and reliability under extreme environmental conditions. Its low-power architecture combined with high-speed operation enables efficient signal processing and logic functions even in challenging environments.

    - High-Temperature Applications: In automotive and industrial environments with elevated temperatures, the LCMXO3LF-6900C-6BG400I FPGA maintains stable operation without degradation in performance, ensuring continuous system functionality.

    - Low-Temperature Applications: In cold environments, such as aerospace and outdoor applications, the LCMXO3LF-6900C-6BG400I FPGA operates reliably even at sub-zero temperatures, providing uninterrupted service in extreme conditions.

    - High-Humidity Environments: In humid environments, the LCMXO3LF-6900C-6BG400I FPGA's moisture-resistant design prevents moisture ingress and maintains electrical integrity, ensuring long-term reliability and performance stability.

    - Reliability Testing: Before deployment in critical applications, the LCMXO3LF-6900C-6BG400I FPGA undergoes rigorous reliability testing, including temperature cycling, humidity exposure, and vibration testing, to validate its performance and durability under extreme environmental conditions.

    Conclusion:

    The LCMXO3LF-6900C-6BG400I FPGA offers exceptional performance and reliability in extreme environmental conditions, making it an ideal choice for mission-critical applications where robustness and resilience are paramount. Its comprehensive design considerations and thorough testing ensure dependable operation across a wide range of challenging environments, providing engineers with a versatile solution for demanding applications.

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    3. Are the LCMXO3LF-6900C-6BG400I price and inventory displayed accurate?

    The price and inventory of LCMXO3LF-6900C-6BG400I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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    6. What is the process for return or replacement of LCMXO3LF-6900C-6BG400I?

    All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO3LF-6900C-6BG400I we delivered, we will accept the replacement or return of the LCMXO3LF-6900C-6BG400I only when all of the below conditions are fulfilled:

    (1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

    (2)We are informed of the defect described above within 90 days after the delivery of LCMXO3LF-6900C-6BG400I.

    (3)The PartNo is unused and only in the original unpacked packaging.

    Two processes to return the products:

    (1)Inform us within 90 days

    (2)Obtain Requesting Return Authorizations

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