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Name: LCMXO3LF-6900C-6BG324I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO3LF-6900C-6BG324I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO3LF-6900C-6BG324I

Part No.:: LCMXO3LF-6900C-6BG324I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 324-LFBGA

Datasheet:: LCMXO3LF-6900C-6BG324I.pdf

Description:: IC FPGA 279 I/O 324CABGA

In Stock:: 2809

Quantity:: Add To Cart

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LCMXO3LF-6900C-6BG324I Specifications

Package/Case:
324-LFBGA
Packaging:
Tray
Series:
MachXO3
ProductStatus:
Active
NumberofLABs/CLBs:
858
NumberofLogicElements/Cells:
6864
TotalRAMBits:
245760
NumberofI/O:
279
NumberofGates:
-
Voltage-Supply:
2.375V ~ 3.465V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

LCMXO3LF-6900C-6BG324I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO3LF-6900C-6BG324I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO3LF-6900C-6BG324I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO3LF-6900C-6BG324I information

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LCMXO3LF-6900C-6BG324I performance and reliability evaluation in extreme environments

LCMXO3LF-6900C-6BG324I is a low-power, low-cost FPGA (Field-Programmable Gate Array) device manufactured by Lattice Semiconductor. It is designed to offer high performance and flexibility for a wide range of applications, including industrial automation, telecommunications, and consumer electronics.

Environmental Considerations:

In extreme environments, such as high temperatures, low temperatures, and high humidity, the performance and reliability of LCMXO3LF-6900C-6BG324I need to be carefully evaluated and ensured. To address these environmental factors, the following considerations are made in the design process:

1. Thermal Management: The FPGA device should be equipped with efficient thermal management techniques, such as heat sinks or thermal vias, to dissipate heat effectively, especially in high-temperature environments. Proper airflow and heat dissipation mechanisms should be incorporated into the system design to prevent overheating and ensure reliable operation.

2. Temperature Compensation: The FPGA's performance characteristics may vary with temperature fluctuations. Temperature compensation techniques, such as dynamic voltage and frequency scaling (DVFS), can be implemented to maintain stable operation across a wide temperature range. Additionally, temperature sensors can be integrated into the system to monitor and adjust operating parameters accordingly.

3. Moisture Protection: Exposure to high humidity levels can lead to moisture ingress, potentially causing electrical shorts or corrosion within the FPGA device. Therefore, protective coatings, conformal coatings, or sealing techniques should be applied to safeguard the device against moisture ingress and ensure long-term reliability in humid environments.

4. Material Selection: The selection of materials for PCB (Printed Circuit Board) substrates, solder masks, and components should consider their compatibility with extreme environmental conditions. High-temperature resistant materials and corrosion-resistant coatings can enhance the durability and reliability of the FPGA system in harsh operating environments.

Performance Analysis:

Despite the challenges posed by extreme environments, LCMXO3LF-6900C-6BG324I demonstrates robust performance and reliability in real-world applications. Through comprehensive testing and validation, the FPGA device has shown the following key performance attributes:

1. High-Speed Processing: The FPGA's configurable logic fabric and embedded DSP (Digital Signal Processing) blocks enable high-speed data processing and computation, facilitating rapid response times and efficient algorithm execution in time-critical applications.

2. Low Power Consumption: With its low-power architecture and advanced power management features, LCMXO3LF-6900C-6BG324I minimizes energy consumption, making it suitable for battery-operated or power-constrained devices in remote or harsh environments.

3. Flexible Configuration: The FPGA's reprogrammable nature allows for on-the-fly configuration updates and customization, enabling adaptive behavior and versatility to accommodate changing environmental conditions or application requirements.

4. Reliability: Through rigorous reliability testing, including temperature cycling, humidity testing, and accelerated aging, LCMXO3LF-6900C-6BG324I has demonstrated robustness and resilience against environmental stressors, ensuring dependable operation in demanding industrial and automotive applications.

Conclusion:

In conclusion, LCMXO3LF-6900C-6BG324I excels in performance and reliability even in extreme environmental conditions, thanks to its advanced design features and thorough validation processes. By addressing environmental considerations and leveraging its inherent capabilities, the FPGA device offers a dependable solution for a wide range of applications, empowering innovation and success in challenging operating environments.

LCMXO3LF-6900C-6BG324I FAQ

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The price and inventory of LCMXO3LF-6900C-6BG324I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of LCMXO3LF-6900C-6BG324I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO3LF-6900C-6BG324I we delivered, we will accept the replacement or return of the LCMXO3LF-6900C-6BG324I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO3LF-6900C-6BG324I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations