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Name: LCMXO3LF-6900C-5BG256C
Brand: Lattice Semiconductor Corporation
SKU: LCMXO3LF-6900C-5BG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO3LF-6900C-5BG256C

Part No.:: LCMXO3LF-6900C-5BG256C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LFBGA

Datasheet:: LCMXO3LF-6900C-5BG256C.pdf

Description:: IC FPGA 206 I/O 256CABGA

In Stock:: 3307

Quantity:: Add To Cart

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LCMXO3LF-6900C-5BG256C Specifications

Package/Case:
256-LFBGA
Packaging:
Tray
Series:
MachXO3
ProductStatus:
Active
NumberofLABs/CLBs:
858
NumberofLogicElements/Cells:
6864
TotalRAMBits:
245760
NumberofI/O:
206
NumberofGates:
-
Voltage-Supply:
2.375V ~ 3.465V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

LCMXO3LF-6900C-5BG256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO3LF-6900C-5BG256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO3LF-6900C-5BG256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO3LF-6900C-5BG256C information

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LCMXO3LF-6900C-5BG256C performance and reliability evaluation in extreme environments

LCMXO3LF-6900C-5BG256C is a field-programmable gate array (FPGA) featuring low power consumption, high performance, and versatility in various embedded applications.

Environment Considerations:

In designing with LCMXO3LF-6900C-5BG256C, several environmental factors must be considered to ensure reliable operation, especially in extreme conditions:

1. Temperature: The FPGA's performance and reliability can be affected by temperature fluctuations. Therefore, thermal management strategies, such as heatsinks or fans, should be employed to maintain optimal operating temperatures.

2. Humidity: High humidity levels can lead to moisture ingress, potentially causing short circuits or corrosion on the FPGA. Proper sealing and conformal coating techniques should be implemented to protect the device from moisture damage.

3. Shock and Vibration: Mechanical stresses from shock and vibration can impact the structural integrity of the FPGA and its solder connections. Secure mounting and vibration dampening mechanisms are necessary to mitigate these effects.

4. Electrical Noise: External electrical noise can interfere with the FPGA's operation, leading to signal integrity issues or functional errors. Proper grounding, shielding, and filtering techniques should be applied to minimize noise susceptibility.

Performance Analysis:

Despite challenging environmental conditions, LCMXO3LF-6900C-5BG256C demonstrates robust performance and reliability in practical applications:

1. Low Power Consumption: The FPGA's low power consumption makes it suitable for battery-operated or power-sensitive devices, ensuring extended operational lifetimes in remote or energy-constrained environments.

2. High Performance: With its advanced architecture and configurable logic elements, LCMXO3LF-6900C-5BG256C delivers high-speed processing and efficient resource utilization, meeting the demanding requirements of real-time embedded systems.

3. Versatility: The FPGA's programmability allows for flexible adaptation to diverse application needs, enabling rapid prototyping and iterative development cycles for customized solutions in industrial, automotive, and aerospace sectors.

4. Reliability: Through rigorous testing and validation procedures, LCMXO3LF-6900C-5BG256C ensures reliable operation across wide temperature ranges, humidity levels, and mechanical stresses, meeting stringent quality standards for mission-critical deployments.

Conclusion:

In summary, LCMXO3LF-6900C-5BG256C exemplifies a resilient FPGA solution capable of withstanding extreme environmental conditions while delivering high performance, low power consumption, and unmatched reliability in embedded applications.

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6. What is the process for return or replacement of LCMXO3LF-6900C-5BG256C?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO3LF-6900C-5BG256C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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