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Name: LCMXO3L-9400C-5BG256I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO3L-9400C-5BG256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO3L-9400C-5BG256I

Part No.:: LCMXO3L-9400C-5BG256I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LFBGA

Datasheet:: LCMXO3L-9400C-5BG256I.pdf

Description:: IC FPGA 206 I/O 256CABGA

In Stock:: 3013

Quantity:: Add To Cart

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LCMXO3L-9400C-5BG256I Specifications

Package/Case:
256-LFBGA
Packaging:
Tray
Series:
MachXO3
ProductStatus:
Active
NumberofLABs/CLBs:
1175
NumberofLogicElements/Cells:
9400
TotalRAMBits:
442368
NumberofI/O:
206
NumberofGates:
-
Voltage-Supply:
2.375V ~ 3.465V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

LCMXO3L-9400C-5BG256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO3L-9400C-5BG256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO3L-9400C-5BG256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO3L-9400C-5BG256I information

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LCMXO3L-9400C-5BG256I performance and reliability evaluation in extreme environments

LCMXO3L-9400C-5BG256I is a field-programmable gate array (FPGA) chip designed for applications requiring high reliability and performance in extreme environmental conditions. With its robust design and advanced features, it excels in challenging scenarios where temperature, humidity, and other environmental factors pose significant challenges.

Environmental Considerations:

In the design of LCMXO3L-9400C-5BG256I-based systems, environmental factors play a crucial role in ensuring reliable operation. The following considerations are taken into account:

- High Temperature: The FPGA chip is designed to operate reliably at elevated temperatures, up to a certain threshold, without compromising performance or longevity. Heat dissipation mechanisms, such as heat sinks or thermal management techniques, may be employed to regulate the temperature and prevent overheating.

- Low Temperature: Similarly, the FPGA chip is engineered to withstand low temperatures encountered in extreme cold environments. Special attention is paid to the materials and components used in the chip's construction to ensure resilience against temperature extremes and prevent performance degradation.

- Humidity and Moisture: The LCMXO3L-9400C-5BG256I chip is designed with moisture-resistant packaging and coatings to mitigate the effects of humidity and moisture ingress. This helps prevent corrosion, electrical shorts, and other reliability issues that may arise in humid environments.

- Vibration and Shock: The FPGA chip undergoes rigorous testing to ensure resilience against mechanical stresses, including vibration and shock. Robust packaging and mounting techniques are employed to secure the chip in place and minimize the risk of damage or malfunction due to mechanical disturbances.

- Radiation: In environments where radiation exposure is a concern, such as aerospace or nuclear applications, the LCMXO3L-9400C-5BG256I chip is designed with radiation-hardened materials and structures to withstand ionizing radiation and maintain functionality without errors or failures.

Performance in Practical Applications:

In real-world applications, LCMXO3L-9400C-5BG256I demonstrates exceptional performance and reliability in extreme environmental conditions. For example, in aerospace applications, where temperature fluctuations and radiation exposure are common, the FPGA chip reliably controls critical systems with minimal downtime or errors.

Moreover, in industrial automation settings, where high temperatures, humidity, and mechanical stresses are prevalent, LCMXO3L-9400C-5BG256I-based systems excel in providing robust and efficient operation, ensuring continuous production and process control.

Overall, the LCMXO3L-9400C-5BG256I FPGA chip's robust design, coupled with its advanced features and performance capabilities, makes it a preferred choice for applications demanding reliability and performance in extreme environmental conditions.

LCMXO3L-9400C-5BG256I FAQ

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6. What is the process for return or replacement of LCMXO3L-9400C-5BG256I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO3L-9400C-5BG256I we delivered, we will accept the replacement or return of the LCMXO3L-9400C-5BG256I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO3L-9400C-5BG256I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations