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Name: LCMXO3L-6900E-6MG324I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO3L-6900E-6MG324I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO3L-6900E-6MG324I

Part No.:: LCMXO3L-6900E-6MG324I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 324-VFBGA

Datasheet:: LCMXO3L-6900E-6MG324I.pdf

Description:: IC FPGA 281 I/O 324CSFBGA

In Stock:: 3078

Quantity:: Add To Cart

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LCMXO3L-6900E-6MG324I Specifications

Package/Case:
324-VFBGA
Packaging:
Tray
Series:
MachXO3
ProductStatus:
Active
NumberofLABs/CLBs:
858
NumberofLogicElements/Cells:
6864
TotalRAMBits:
245760
NumberofI/O:
281
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

LCMXO3L-6900E-6MG324I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO3L-6900E-6MG324I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO3L-6900E-6MG324I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO3L-6900E-6MG324I information

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LCMXO3L-6900E-6MG324I performance and reliability evaluation in extreme environments

LCMXO3L-6900E-6MG324I is a field-programmable gate array (FPGA) chip known for its high performance and reliability, suitable for deployment in extreme environmental conditions. Its robust design and versatile functionality make it ideal for applications requiring resilience to temperature extremes, humidity, and other environmental factors.

Application Scenario:

In aerospace and defense systems, LCMXO3L-6900E-6MG324I plays a crucial role in signal processing, data encryption, and control functions. These systems often operate in harsh environments, including high altitudes, extreme temperatures, and fluctuating humidity levels.

Design Considerations:

When incorporating LCMXO3L-6900E-6MG324I into a circuit design for extreme environments, several factors must be considered:

1. Temperature Management:

The FPGA's operating temperature range must align with the environmental conditions of the intended application. Thermal management techniques such as heat sinks, fans, or passive cooling systems may be necessary to ensure optimal performance under high temperature conditions.

2. Environmental Sealing:

To protect the LCMXO3L-6900E-6MG324I from moisture and humidity, the circuit board housing the FPGA should be sealed using conformal coating or potting materials. This prevents corrosion and electrical shorts that can occur in humid environments.

3. Component Selection:

Choose electronic components with wide operating temperature ranges and high reliability ratings to complement the LCMXO3L-6900E-6MG324I. This ensures the entire system can withstand temperature fluctuations without compromising performance or longevity.

4. Signal Integrity:

Ensure proper signal integrity by implementing impedance matching techniques and minimizing signal reflections. High-speed interfaces and communication protocols must be robust enough to maintain reliable data transmission in extreme conditions.

5. Testing and Validation:

Prioritize comprehensive testing and validation procedures to assess the LCMXO3L-6900E-6MG324I's performance under simulated extreme environmental conditions. Environmental chambers can be used to subject the FPGA to temperature extremes, humidity, and vibration, allowing engineers to verify its reliability and functionality.

Performance Analysis:

In practical applications, LCMXO3L-6900E-6MG324I has demonstrated exceptional performance and reliability in extreme environments. It withstands temperature fluctuations ranging from -40°C to 125°C, making it suitable for both Arctic and desert climates. Furthermore, its low power consumption and high-speed processing capabilities ensure efficient operation even in constrained power or space environments.

Conclusion:

With its robust design, wide operating temperature range, and versatile functionality, LCMXO3L-6900E-6MG324I is a reliable choice for applications requiring FPGA performance in extreme environmental conditions. By carefully considering design factors such as temperature management, environmental sealing, component selection, signal integrity, and rigorous testing, engineers can harness the full potential of this FPGA in challenging operational environments.

LCMXO3L-6900E-6MG324I FAQ

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6. What is the process for return or replacement of LCMXO3L-6900E-6MG324I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO3L-6900E-6MG324I we delivered, we will accept the replacement or return of the LCMXO3L-6900E-6MG324I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO3L-6900E-6MG324I.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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