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Name: LCMXO3L-6900C-5BG324I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO3L-6900C-5BG324I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO3L-6900C-5BG324I

Part No.:: LCMXO3L-6900C-5BG324I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 324-LFBGA

Datasheet:: LCMXO3L-6900C-5BG324I.pdf

Description:: IC FPGA 279 I/O 324CABGA

In Stock:: 2714

Quantity:: Add To Cart

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LCMXO3L-6900C-5BG324I Specifications

Package/Case:
324-LFBGA
Packaging:
Tray
Series:
MachXO3
ProductStatus:
Active
NumberofLABs/CLBs:
858
NumberofLogicElements/Cells:
6864
TotalRAMBits:
245760
NumberofI/O:
279
NumberofGates:
-
Voltage-Supply:
2.375V ~ 3.465V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

LCMXO3L-6900C-5BG324I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO3L-6900C-5BG324I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO3L-6900C-5BG324I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO3L-6900C-5BG324I information

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LCMXO3L-6900C-5BG324I performance and reliability evaluation in extreme environments

LCMXO3L-6900C-5BG324I is a field-programmable gate array (FPGA) chip manufactured by Lattice Semiconductor, offering high performance and flexibility for a wide range of applications. Its compact size and low power consumption make it suitable for deployment in various environments, including extreme conditions.

Environmental Considerations:

When designing systems incorporating LCMXO3L-6900C-5BG324I, engineers must carefully consider the environmental factors to ensure reliable operation under extreme conditions. These factors include:

- High Temperature: The FPGA should be capable of withstanding high temperatures without degradation in performance or reliability. Heat dissipation mechanisms and proper thermal management techniques must be employed to prevent overheating.

- Low Temperature: Similarly, the FPGA should operate reliably at low temperatures commonly encountered in applications such as aerospace or automotive systems. Cold temperature testing and appropriate component selection are essential to ensure functionality in frigid environments.

- Humidity: Moisture ingress can adversely affect the performance of electronic components. Therefore, protective measures such as conformal coating or hermetic sealing may be necessary to safeguard the LCMXO3L-6900C-5BG324I from humidity-induced damage.

- Vibration and Shock: In rugged environments or transportation applications, the FPGA must withstand mechanical stresses caused by vibration and shock. Secure mounting and robust packaging techniques should be implemented to mitigate these effects and maintain operational integrity.

Performance Analysis:

Despite the challenges posed by extreme environmental conditions, LCMXO3L-6900C-5BG324I demonstrates remarkable performance and reliability in practical applications. For instance:

- In aerospace systems, where temperature fluctuations and vibration are prevalent, LCMXO3L-6900C-5BG324I has proven its resilience by delivering consistent performance in critical avionics functions.

- Automotive electronics leveraging LCMXO3L-6900C-5BG324I benefit from its ability to operate reliably across a wide temperature range, ensuring uninterrupted functionality in varying climatic conditions.

- Industrial automation systems, subjected to harsh environments such as high humidity and temperature, rely on the robustness of LCMXO3L-6900C-5BG324I to maintain continuous operation without succumbing to environmental stressors.

- In remote sensing applications deployed in extreme terrains, the compact form factor and low power consumption of LCMXO3L-6900C-5BG324I enable efficient data processing and transmission, even in challenging environmental conditions.

Conclusion:

LCMXO3L-6900C-5BG324I exemplifies resilience and adaptability in extreme environments, thanks to its robust design and advanced manufacturing techniques. By considering environmental factors during system design and deployment, engineers can harness the full potential of this FPGA for diverse applications, ranging from aerospace and automotive to industrial and IoT devices.

LCMXO3L-6900C-5BG324I FAQ

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3. Are the LCMXO3L-6900C-5BG324I price and inventory displayed accurate?

The price and inventory of LCMXO3L-6900C-5BG324I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of LCMXO3L-6900C-5BG324I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO3L-6900C-5BG324I we delivered, we will accept the replacement or return of the LCMXO3L-6900C-5BG324I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO3L-6900C-5BG324I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations