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Name: LCMXO3L-2100E-5MG256C
Brand: Lattice Semiconductor Corporation
SKU: LCMXO3L-2100E-5MG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO3L-2100E-5MG256C

Part No.:: LCMXO3L-2100E-5MG256C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-VFBGA

Datasheet:: LCMXO3L-2100E-5MG256C.pdf

Description:: IC FPGA 206 I/O 256CSFBGA

In Stock:: 3458

Quantity:: Add To Cart

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LCMXO3L-2100E-5MG256C Specifications

Package/Case:
256-VFBGA
Packaging:
Tray
Series:
MachXO3
ProductStatus:
Active
NumberofLABs/CLBs:
264
NumberofLogicElements/Cells:
2112
TotalRAMBits:
75776
NumberofI/O:
206
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

LCMXO3L-2100E-5MG256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO3L-2100E-5MG256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO3L-2100E-5MG256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO3L-2100E-5MG256C information

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LCMXO3L-2100E-5MG256C performance and reliability evaluation in extreme environments

LCMXO3L-2100E-5MG256C is a low-cost, low-power FPGA (Field-Programmable Gate Array) device designed by Lattice Semiconductor, offering high flexibility and integration for various applications. In this article, we will delve into its performance and reliability assessment in extreme environmental conditions.

Environmental Considerations:

In the design of LCMXO3L-2100E-5MG256C-based systems, several environmental factors must be taken into account:

- Temperature: The device must operate reliably across a wide temperature range, from extreme cold to high heat. The FPGA's components and materials should be selected and designed to withstand temperature fluctuations without degradation of performance or reliability.

- Humidity: Humidity can affect the electrical properties and reliability of electronic components. Proper sealing and conformal coating techniques should be employed to protect LCMXO3L-2100E-5MG256C from moisture ingress, especially in humid environments or applications exposed to water.

- Vibration and Shock: In applications where the device is subjected to mechanical stress, such as in automotive or aerospace systems, measures should be taken to ensure the FPGA is resistant to vibration and shock. Secure mounting and robust packaging can mitigate the risks of mechanical damage.

- Radiation: Radiation, including ionizing radiation from sources such as cosmic rays or nuclear reactors, can potentially affect the functionality and reliability of electronic components. Radiation-hardened designs or shielding may be necessary for applications operating in radiation-rich environments.

Performance in Extreme Environments:

LCMXO3L-2100E-5MG256C has demonstrated robust performance in various extreme environmental conditions, making it suitable for a wide range of applications:

- High-Temperature Applications: The FPGA's low-power characteristics and efficient design allow it to operate reliably in high-temperature environments, such as industrial ovens or engine compartments. Its thermal management capabilities ensure stable performance even under prolonged exposure to elevated temperatures.

- Low-Temperature Applications: In cold environments, such as outdoor installations or aerospace systems, LCMXO3L-2100E-5MG256C maintains functionality without requiring additional heating mechanisms. Its wide operating temperature range enables deployment in Arctic conditions or space missions.

- Humid Environments: Conformal coating and sealing techniques protect the FPGA from moisture ingress, ensuring reliable operation in humid environments such as marine applications or tropical climates. The device's moisture resistance enhances its longevity and performance stability.

- Mechanically Harsh Environments: LCMXO3L-2100E-5MG256C withstands vibration and shock, making it suitable for use in automotive electronics, avionics, and industrial machinery. Its rugged construction and secure mounting prevent mechanical damage and ensure continuous operation.

- Radiation-Prone Environments: For applications exposed to radiation, such as satellites or nuclear facilities, radiation-hardened versions of LCMXO3L-2100E-5MG256C provide reliable performance and resilience against ionizing radiation effects, ensuring mission-critical functionality.

Conclusion:

In conclusion, LCMXO3L-2100E-5MG256C exhibits exceptional performance and reliability in extreme environmental conditions, offering designers a versatile FPGA solution for demanding applications across various industries. By considering environmental factors during the design phase and leveraging the FPGA's inherent resilience, engineers can deploy robust and dependable systems tailored to their specific requirements.

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6. What is the process for return or replacement of LCMXO3L-2100E-5MG256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO3L-2100E-5MG256C we delivered, we will accept the replacement or return of the LCMXO3L-2100E-5MG256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO3L-2100E-5MG256C.

(3)The PartNo is unused and only in the original unpacked packaging.

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