LCMXO256E-4MN100I

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Lattice Semiconductor Corporation LCMXO256E-4MN100I

HIGH-RELIABILITY-COMPONENTS
Part No.:
LCMXO256E-4MN100I
Manufacturer:
Lattice Semiconductor Corporation
Package:
100-LFBGA, CSPBGA
Datasheet:
LCMXO256E-4MN100I.pdf
Description:
IC FPGA 78 I/O 100CSBGA
In Stock:
3469
Quantity:
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  • Purchase and inquiryPurchase and inquiry

    LCMXO256E-4MN100I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO256E-4MN100I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO256E-4MN100I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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    LCMXO256E-4MN100I informationLCMXO256E-4MN100I information

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    LCMXO256E-4MN100I performance and reliability evaluation in extreme environments


    LCMXO256E-4MN100I is a low-power, small-footprint FPGA (Field-Programmable Gate Array) device manufactured by Lattice Semiconductor. It offers high reliability and versatility, making it suitable for a wide range of applications, including those operating in extreme environmental conditions.

    Environmental Considerations:

    When designing systems with LCMXO256E-4MN100I for extreme environments, several environmental factors need to be considered:

    - Temperature: The device is designed to operate reliably within a wide temperature range, from -40°C to 125°C. Special attention should be given to thermal management to ensure that the device operates within its specified temperature limits under varying thermal conditions.

    - Humidity: While the device itself is not sensitive to humidity, the overall system design should consider the effects of moisture ingress, especially in applications exposed to high humidity or moisture-rich environments. Proper conformal coating and sealing techniques may be necessary to protect the device and surrounding components.

    - Vibration and Shock: In environments with high levels of vibration or mechanical shock, the system should be designed to withstand these conditions. Secure mounting and vibration-damping techniques can help prevent mechanical stress on the device and solder joints.

    - Radiation: For applications in radiation-rich environments, such as aerospace or nuclear facilities, the device should be evaluated for its susceptibility to radiation-induced effects, such as single-event upsets (SEUs) or total ionizing dose (TID) effects. Radiation-hardened or radiation-tolerant designs may be necessary for such applications.

    Performance Analysis:

    Despite the challenges posed by extreme environments, LCMXO256E-4MN100I demonstrates robust performance and reliability in practical applications. Its key features include:

    - Low Power Consumption: The device's low-power architecture ensures efficient operation, making it suitable for battery-powered or energy-constrained applications in remote or harsh environments.

    - Small Form Factor: With its compact footprint, LCMXO256E-4MN100I enables the design of compact, space-efficient systems, ideal for deployment in constrained environments or applications with size limitations.

    - High Flexibility: Being a FPGA device, LCMXO256E-4MN100I offers programmable logic resources that can be tailored to specific application requirements, allowing for versatile functionality and customization to suit diverse environmental conditions.

    - Reliability: Through rigorous testing and qualification processes, LCMXO256E-4MN100I ensures reliable operation even in challenging environments, minimizing the risk of unexpected failures or downtime.

    - Extended Temperature Range: The device's wide operating temperature range enables deployment in environments with extreme temperature variations, providing consistent performance across a broad spectrum of operating conditions.

    Conclusion:

    In conclusion, LCMXO256E-4MN100I stands out as a resilient and dependable FPGA solution for applications demanding high reliability and performance in extreme environmental conditions. By addressing environmental factors such as temperature, humidity, vibration, and radiation, and leveraging its key attributes of low power consumption, small form factor, and flexibility, the device offers a compelling solution for a variety of mission-critical applications across industries.

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    3. Are the LCMXO256E-4MN100I price and inventory displayed accurate?

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    6. What is the process for return or replacement of LCMXO256E-4MN100I?

    All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO256E-4MN100I we delivered, we will accept the replacement or return of the LCMXO256E-4MN100I only when all of the below conditions are fulfilled:

    (1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

    (2)We are informed of the defect described above within 90 days after the delivery of LCMXO256E-4MN100I.

    (3)The PartNo is unused and only in the original unpacked packaging.

    Two processes to return the products:

    (1)Inform us within 90 days

    (2)Obtain Requesting Return Authorizations

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