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Name: LCMXO2280C-3MN132C
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2280C-3MN132C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2280C-3MN132C

Part No.:: LCMXO2280C-3MN132C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 132-LFBGA, CSPBGA

Datasheet:: LCMXO2280C-3MN132C.pdf

Description:: IC FPGA 101 I/O 132CSBGA

In Stock:: 2618

Quantity:: Add To Cart

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LCMXO2280C-3MN132C Specifications

Package/Case:
132-LFBGA, CSPBGA
Packaging:
Tray
Series:
MachXO
ProductStatus:
Active
NumberofLABs/CLBs:
285
NumberofLogicElements/Cells:
2280
TotalRAMBits:
28262
NumberofI/O:
101
NumberofGates:
-
Voltage-Supply:
1.71V ~ 3.465V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

LCMXO2280C-3MN132C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2280C-3MN132C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2280C-3MN132C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2280C-3MN132C information

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LCMXO2280C-3MN132C performance and reliability evaluation in extreme environments

LCMXO2280C-3MN132C is a field-programmable gate array (FPGA) chip known for its versatility and reliability in extreme environmental conditions. This article explores its performance and reliability assessment in such environments, focusing on its design considerations for factors like high temperature, low temperature, humidity, and its practical applications.

Design Considerations:

Incorporating LCMXO2280C-3MN132C into electronic systems operating in extreme environments necessitates careful consideration of various factors:

- High Temperature: The chip's design integrates temperature-resistant materials and optimized circuitry to withstand high temperatures without compromising performance or reliability. Additionally, thermal management techniques such as heat sinks or thermal vias may be employed to dissipate heat effectively.

- Low Temperature: Special attention is given to ensure the functionality of LCMXO2280C-3MN132C even in freezing temperatures. This involves selecting components rated for low-temperature operation and implementing insulation measures to prevent damage from cold temperatures.

- Humidity: The chip's packaging and sealing are designed to prevent moisture ingress, minimizing the risk of corrosion or short circuits due to humidity. Additionally, conformal coating or potting may be applied to further enhance moisture resistance.

- Vibration and Shock: The chip's mechanical robustness is enhanced to withstand vibrations and shocks commonly encountered in harsh environments. This may involve ruggedized packaging and shock-absorbing mounting techniques.

- Radiation: For applications in radiation-prone environments such as space or nuclear facilities, LCMXO2280C-3MN132C may incorporate radiation-hardened materials and designs to mitigate the effects of ionizing radiation.

Performance in Practical Applications:

LCMXO2280C-3MN132C has demonstrated exceptional performance and reliability in various real-world applications, including:

- Aerospace and Defense: In aerospace applications, the FPGA reliably handles critical tasks such as flight control, data processing, and communication in extreme temperatures and radiation environments.

- Industrial Automation: In industrial settings, LCMXO2280C-3MN132C facilitates precise control and monitoring tasks even in harsh conditions, contributing to increased efficiency and reliability of manufacturing processes.

- Automotive Electronics: Automotive systems leverage the ruggedness and versatility of LCMXO2280C-3MN132C to withstand temperature variations, vibrations, and humidity, ensuring reliable performance in vehicles operating in diverse climates.

- Energy Sector: In energy production facilities, such as oil rigs or wind farms, the FPGA's resilience enables continuous operation under challenging environmental conditions, enhancing overall system uptime and reliability.

Conclusion:

LCMXO2280C-3MN132C stands out as a reliable and high-performance FPGA suitable for use in extreme environmental conditions. Its robust design, incorporating features to withstand temperature extremes, humidity, vibration, and radiation, makes it an ideal choice for mission-critical applications where reliability is paramount.

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6. What is the process for return or replacement of LCMXO2280C-3MN132C?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO2280C-3MN132C.

(3)The PartNo is unused and only in the original unpacked packaging.

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