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Name: LCMXO2-7000ZE-3FTG256C
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-7000ZE-3FTG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2-7000ZE-3FTG256C

Part No.:: LCMXO2-7000ZE-3FTG256C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LBGA

Datasheet:: LCMXO2-7000ZE-3FTG256C.pdf

Description:: IC FPGA 206 I/O 256FTBGA

In Stock:: 3833

Quantity:: Add To Cart

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LCMXO2-7000ZE-3FTG256C Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
MachXO2
ProductStatus:
Active
NumberofLABs/CLBs:
858
NumberofLogicElements/Cells:
6864
TotalRAMBits:
245760
NumberofI/O:
206
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

LCMXO2-7000ZE-3FTG256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-7000ZE-3FTG256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-7000ZE-3FTG256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2-7000ZE-3FTG256C information

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LCMXO2-7000ZE-3FTG256C performance and reliability evaluation in extreme environments

LCMXO2-7000ZE-3FTG256C is a Field-Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor, designed to offer low power consumption and high performance in various embedded applications. It is particularly suitable for use in environments with extreme conditions due to its robust design and reliability features.

Environmental Considerations:

In the design of LCMXO2-7000ZE-3FTG256C-based systems, several environmental factors must be taken into account to ensure reliable operation:

- High Temperature: The FPGA is tested and rated for operation in high-temperature environments, up to a certain threshold. Thermal management techniques, such as heatsinks or fans, can be employed to dissipate heat effectively and prevent overheating.

- Low Temperature: Similarly, the FPGA's performance in low-temperature conditions is crucial. It should be able to operate reliably even in freezing temperatures, which may require additional insulation or heating elements in the system design.

- Humidity: Moisture can impact the performance and longevity of electronic components. Therefore, proper sealing and conformal coating may be necessary to protect the LCMXO2-7000ZE-3FTG256C from humidity and moisture ingress.

- Shock and Vibration: In rugged environments or applications such as automotive or aerospace, the FPGA must withstand mechanical stress, including shock and vibration. Secure mounting and robust packaging can help mitigate these effects.

- Radiation: For applications in space or nuclear environments, radiation hardening techniques may be required to ensure the LCMXO2-7000ZE-3FTG256C remains operational despite exposure to ionizing radiation.

Performance in Practical Applications:

The LCMXO2-7000ZE-3FTG256C FPGA has demonstrated exceptional performance and reliability in a wide range of applications, including:

- Industrial Control Systems: Used for process automation, motor control, and monitoring in factories and manufacturing plants, where environmental conditions can vary significantly.

- Automotive Electronics: Employed in vehicle control units, infotainment systems, and driver assistance systems, requiring resilience to temperature extremes, vibrations, and electrical noise.

- Aerospace and Defense: Utilized in avionics, navigation systems, and mission-critical applications, demanding ruggedness, reliability, and resistance to harsh environmental conditions.

- Medical Devices: Integrated into diagnostic equipment, patient monitoring systems, and medical imaging devices, where reliability and accuracy are paramount for patient safety.

- Telecommunications: Deployed in network infrastructure, base stations, and communication satellites, necessitating continuous operation in diverse environmental conditions without compromising performance.

Conclusion:

The LCMXO2-7000ZE-3FTG256C FPGA exhibits robustness and reliability in extreme environmental conditions, making it a versatile choice for a wide range of applications. By considering environmental factors during the design phase and implementing appropriate mitigation strategies, designers can ensure optimal performance and longevity of systems utilizing this FPGA.

LCMXO2-7000ZE-3FTG256C FAQ

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6. What is the process for return or replacement of LCMXO2-7000ZE-3FTG256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO2-7000ZE-3FTG256C we delivered, we will accept the replacement or return of the LCMXO2-7000ZE-3FTG256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO2-7000ZE-3FTG256C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations