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Name: LCMXO2-7000HC-6FTG256C
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-7000HC-6FTG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2-7000HC-6FTG256C

Part No.:: LCMXO2-7000HC-6FTG256C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LBGA

Datasheet:: LCMXO2-7000HC-6FTG256C.pdf

Description:: IC FPGA 206 I/O 256FTBGA

In Stock:: 2820

Quantity:: Add To Cart

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LCMXO2-7000HC-6FTG256C Specifications

Package/Case:
256-LBGA
Packaging:
Bulk,Tray
Series:
MachXO2
ProductStatus:
Active
NumberofLABs/CLBs:
858
NumberofLogicElements/Cells:
6864
TotalRAMBits:
245760
NumberofI/O:
206
NumberofGates:
-
Voltage-Supply:
2.375V ~ 3.465V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

LCMXO2-7000HC-6FTG256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-7000HC-6FTG256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-7000HC-6FTG256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2-7000HC-6FTG256C information

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LCMXO2-7000HC-6FTG256C performance and reliability evaluation in extreme environments

LCMXO2-7000HC-6FTG256C is a field-programmable gate array (FPGA) manufactured by Lattice Semiconductor, offering high-density and low-power programmable logic solutions for various applications. This FPGA features 7000 LUTs, 72 kbits of embedded RAM, and 208 user I/Os, making it suitable for a wide range of designs.

Environmental Considerations:

Incorporating LCMXO2-7000HC-6FTG256C into designs for extreme environments necessitates careful consideration of temperature, humidity, and other factors. The following aspects are crucial in ensuring reliable operation:

1. Temperature: The FPGA's performance can be affected by extremes of temperature. Designers must select appropriate cooling mechanisms or encapsulation materials to maintain the device within its specified temperature range, typically between -40°C to 125°C.

2. Humidity: High humidity levels can lead to condensation, potentially causing short circuits or corrosion. Enclosure designs should include provisions for moisture protection, such as conformal coating or hermetic sealing, to safeguard the LCMXO2-7000HC-6FTG256C against moisture ingress.

3. Shock and Vibration: Applications in harsh environments may subject the FPGA to mechanical stresses from vibration and shock. Mounting solutions and mechanical enclosures should be chosen to minimize the risk of damage or displacement of the device.

4. Chemical Exposure: Certain environments may expose the FPGA to corrosive substances or gases, which can degrade its performance over time. Enclosure materials should be resistant to chemical corrosion, and additional protective measures may be necessary depending on the specific application.

Performance Analysis:

Despite the challenges posed by extreme environments, LCMXO2-7000HC-6FTG256C demonstrates robust performance and reliability in real-world applications. For instance, in aerospace and automotive industries, where temperature variations and mechanical stresses are common, this FPGA has been deployed successfully in control systems, data acquisition, and image processing applications.

Moreover, in industrial automation and IoT deployments, where reliability is paramount, the LCMXO2-7000HC-6FTG256C has proven its ability to operate consistently under challenging conditions, ensuring uninterrupted functionality of critical systems.

Conclusion:

In conclusion, the LCMXO2-7000HC-6FTG256C FPGA offers a reliable solution for applications requiring programmable logic in extreme environments. By addressing environmental factors such as temperature, humidity, shock, and chemical exposure during the design phase, engineers can leverage the full potential of this FPGA while ensuring long-term performance and durability in demanding operating conditions.

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6. What is the process for return or replacement of LCMXO2-7000HC-6FTG256C?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO2-7000HC-6FTG256C.

(3)The PartNo is unused and only in the original unpacked packaging.

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