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Name: LCMXO2-4000ZE-2FTG256C
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-4000ZE-2FTG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2-4000ZE-2FTG256C

Part No.:: LCMXO2-4000ZE-2FTG256C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LBGA

Datasheet:: LCMXO2-4000ZE-2FTG256C.pdf

Description:: IC FPGA 206 I/O 256FTBGA

In Stock:: 3497

Quantity:: Add To Cart

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LCMXO2-4000ZE-2FTG256C Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
MachXO2
ProductStatus:
Active
NumberofLABs/CLBs:
540
NumberofLogicElements/Cells:
4320
TotalRAMBits:
94208
NumberofI/O:
206
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

LCMXO2-4000ZE-2FTG256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-4000ZE-2FTG256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-4000ZE-2FTG256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2-4000ZE-2FTG256C information

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LCMXO2-4000ZE-2FTG256C performance and reliability evaluation in extreme environments

LCMXO2-4000ZE-2FTG256C is a field-programmable gate array (FPGA) chip known for its versatility and reliability, suitable for a wide range of applications in harsh environments. This article explores its performance and reliability assessment in extreme conditions, considering factors such as high temperature, low temperature, humidity, and more.

Environmental Considerations:

In the design of LCMXO2-4000ZE-2FTG256C-based systems for extreme environments, several environmental factors must be considered:

- High Temperature: The chip must withstand elevated temperatures without degradation in performance. Heat dissipation mechanisms and proper thermal management techniques, such as heat sinks and thermal vias, should be employed.

- Low Temperature: Similarly, the chip should operate reliably in low-temperature conditions. Cold-start performance and the impact of temperature variations on device characteristics need to be evaluated.

- Humidity: Moisture can affect the electrical properties of the FPGA and lead to malfunctions or failures. Conformal coating and sealing measures may be necessary to protect the chip from moisture ingress.

- Vibration and Shock: Mechanical stresses from vibration and shock can impact the integrity of solder joints and interconnects. Adequate packaging and mounting techniques should be employed to ensure mechanical robustness.

- Radiation: In radiation-intensive environments, such as space or nuclear applications, the FPGA must be radiation-hardened to prevent single-event upsets (SEUs) and latch-up phenomena.

Performance Analysis:

LCMXO2-4000ZE-2FTG256C demonstrates robust performance in extreme conditions, as evidenced by:

- Temperature Range: Extensive testing confirms the chip's reliable operation across a wide temperature range, from -40°C to 125°C, ensuring suitability for industrial and automotive applications.

- Reliability: The FPGA's built-in features, such as triple-redundant configuration cells and error detection/correction circuits, enhance reliability and fault tolerance in harsh environments.

- Power Efficiency: Despite operating in extreme conditions, LCMXO2-4000ZE-2FTG256C maintains low power consumption, contributing to energy-efficient system designs.

- Functional Safety: The chip's programmable nature allows for implementation of safety-critical functions, meeting industry standards such as ISO 26262 for automotive safety or IEC 61508 for industrial control systems.

Conclusion:

LCMXO2-4000ZE-2FTG256C excels in performance and reliability even in the harshest environments, making it a preferred choice for mission-critical applications where extreme conditions are prevalent. Designers can trust its robustness and versatility to deliver consistent results across various industrial, automotive, aerospace, and defense applications.

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6. What is the process for return or replacement of LCMXO2-4000ZE-2FTG256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO2-4000ZE-2FTG256C we delivered, we will accept the replacement or return of the LCMXO2-4000ZE-2FTG256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO2-4000ZE-2FTG256C.

(3)The PartNo is unused and only in the original unpacked packaging.

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