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Name: LCMXO2-4000ZE-2BG332I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-4000ZE-2BG332I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2-4000ZE-2BG332I

Part No.:: LCMXO2-4000ZE-2BG332I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 332-FBGA

Datasheet:: LCMXO2-4000ZE-2BG332I.pdf

Description:: IC FPGA 274 I/O 332CABGA

In Stock:: 2241

Quantity:: Add To Cart

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LCMXO2-4000ZE-2BG332I Specifications

Package/Case:
332-FBGA
Packaging:
Tray
Series:
MachXO2
ProductStatus:
Active
NumberofLABs/CLBs:
540
NumberofLogicElements/Cells:
4320
TotalRAMBits:
94208
NumberofI/O:
274
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

LCMXO2-4000ZE-2BG332I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-4000ZE-2BG332I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-4000ZE-2BG332I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2-4000ZE-2BG332I information

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LCMXO2-4000ZE-2BG332I performance and reliability evaluation in extreme environments

LCMXO2-4000ZE-2BG332I is a field-programmable gate array (FPGA) device designed by Lattice Semiconductor Corporation, offering high performance and flexibility for a variety of applications. This article explores its performance and reliability evaluation in extreme environmental conditions, including high temperature, low temperature, and humidity.

Environmental Considerations:

Incorporating LCMXO2-4000ZE-2BG332I into designs for extreme environments necessitates careful consideration of environmental factors:

- High Temperature: The FPGA's thermal management system must effectively dissipate heat to prevent overheating and ensure reliable operation. Heat sinks, thermal vias, and proper airflow can mitigate temperature-related issues.

- Low Temperature: Ensuring the FPGA operates reliably in low-temperature environments requires selecting components rated for extended temperature ranges and implementing insulation and heating systems to maintain adequate operating temperatures.

- Humidity: Moisture ingress can degrade performance and reliability. Encapsulation, conformal coating, and humidity-resistant materials help protect the LCMXO2-4000ZE-2BG332I from moisture damage.

Performance Analysis:

The LCMXO2-4000ZE-2BG332I demonstrates robust performance in extreme environments, as evidenced by:

- Temperature Stability: Through rigorous thermal analysis and design optimization, the FPGA maintains stable performance across a wide temperature range, ensuring reliable operation in harsh conditions.

- Reliability: Extensive reliability testing, including accelerated aging tests and environmental stress screening, validates the FPGA's durability and longevity in demanding applications.

- Functionality: The FPGA's flexible architecture enables the implementation of complex logic functions and adaptive algorithms, enhancing system adaptability and performance in dynamic environmental conditions.

- Power Efficiency: Despite challenging operating conditions, the LCMXO2-4000ZE-2BG332I maintains efficient power consumption, minimizing energy waste and extending battery life in portable and remote applications.

- Compatibility: The FPGA's compatibility with industry-standard design tools and interfaces simplifies integration into existing systems, streamlining development and deployment processes for designers working in extreme environments.

Conclusion:

LCMXO2-4000ZE-2BG332I exhibits exceptional performance and reliability in extreme environmental conditions, making it an ideal choice for applications requiring robustness, flexibility, and longevity. By carefully considering environmental factors and leveraging the FPGA's advanced features, designers can create resilient systems capable of operating reliably in the harshest conditions.

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6. What is the process for return or replacement of LCMXO2-4000ZE-2BG332I?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO2-4000ZE-2BG332I.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations