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Name: LCMXO2-256ZE-3MG132C
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-256ZE-3MG132C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2-256ZE-3MG132C

Part No.:: LCMXO2-256ZE-3MG132C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 132-LFBGA, CSPBGA

Datasheet:: LCMXO2-256ZE-3MG132C.pdf

Description:: IC FPGA 55 I/O 132CSBGA

In Stock:: 3382

Quantity:: Add To Cart

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LCMXO2-256ZE-3MG132C Specifications

Package/Case:
132-LFBGA, CSPBGA
Packaging:
Tray
Series:
MachXO2
ProductStatus:
Active
NumberofLABs/CLBs:
32
NumberofLogicElements/Cells:
256
TotalRAMBits:
-
NumberofI/O:
55
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

LCMXO2-256ZE-3MG132C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-256ZE-3MG132C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-256ZE-3MG132C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2-256ZE-3MG132C information

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LCMXO2-256ZE-3MG132C performance and reliability evaluation in extreme environments

LCMXO2-256ZE-3MG132C is a field-programmable gate array (FPGA) chip known for its versatility and reliability in various electronic applications. It offers low power consumption, high performance, and flexibility in design, making it suitable for a wide range of projects.

Application Scenario:

In aerospace and defense systems, LCMXO2-256ZE-3MG132C plays a crucial role in implementing complex signal processing, communication protocols, and control algorithms. It can be utilized in satellite systems, avionics, and unmanned aerial vehicles (UAVs) for tasks such as image processing, data encryption, and navigation.

Design Considerations:

When integrating LCMXO2-256ZE-3MG132C into a design for extreme environments, several factors must be considered:

- Temperature: The FPGA must operate reliably across a wide temperature range, from extreme cold to high heat. Thermal management techniques such as heat sinks, thermal pads, and proper airflow must be employed to ensure the chip stays within its specified temperature limits.

- Vibration and Mechanical Shock: In aerospace and automotive applications, the FPGA may be subjected to significant mechanical stresses. Careful PCB layout and mounting techniques should be implemented to minimize the effects of vibration and shock on the chip's performance.

- Humidity and Moisture: Harsh environmental conditions can include high humidity or exposure to moisture. Conformal coating and sealing methods should be employed to protect the FPGA and surrounding components from moisture ingress, preventing corrosion and electrical shorts.

Performance Analysis:

Despite these challenges, LCMXO2-256ZE-3MG132C demonstrates robust performance in extreme environments. Through rigorous testing and validation, it has shown resilience to temperature variations, mechanical stresses, and moisture exposure.

Real-world Application:

In a satellite communication system, LCMXO2-256ZE-3MG132C is used for signal processing and protocol conversion tasks. Despite the harsh conditions of space, including vacuum, radiation, and temperature extremes, the FPGA maintains reliable operation, ensuring uninterrupted communication between the satellite and ground stations.

Conclusion:

Overall, LCMXO2-256ZE-3MG132C demonstrates exceptional performance and reliability in extreme environments, making it a preferred choice for critical applications in aerospace, defense, and other industries where resilience to harsh conditions is paramount.

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6. What is the process for return or replacement of LCMXO2-256ZE-3MG132C?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO2-256ZE-3MG132C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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