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Name: LCMXO2-256ZE-1SG32C
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-256ZE-1SG32C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2-256ZE-1SG32C

Part No.:: LCMXO2-256ZE-1SG32C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 32-UFQFN Exposed Pad

Datasheet:: LCMXO2-256ZE-1SG32C.pdf

Description:: IC FPGA 21 I/O 32QFNS

In Stock:: 9089

Quantity:: Add To Cart

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LCMXO2-256ZE-1SG32C Specifications

Package/Case:
32-UFQFN Exposed Pad
Packaging:
Tray,Tray
Series:
MachXO2
ProductStatus:
Active
NumberofLABs/CLBs:
32
NumberofLogicElements/Cells:
256
TotalRAMBits:
-
NumberofI/O:
21
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

LCMXO2-256ZE-1SG32C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-256ZE-1SG32C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-256ZE-1SG32C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2-256ZE-1SG32C information

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LCMXO2-256ZE-1SG32C performance and reliability evaluation in extreme environments

LCMXO2-256ZE-1SG32C is a low-cost, low-power FPGA (Field Programmable Gate Array) device manufactured by Lattice Semiconductor. It is designed for applications requiring high performance and flexibility while minimizing power consumption.

Environment Considerations:

In extreme environmental conditions, such as high temperatures, low temperatures, and high humidity, the performance and reliability of LCMXO2-256ZE-1SG32C need to be carefully evaluated.

Design Approach:

To ensure robust operation in extreme environments, the design of systems using LCMXO2-256ZE-1SG32C should consider the following factors:

- Thermal Management: Implement effective heat dissipation mechanisms to prevent overheating of the LCMXO2-256ZE-1SG32C device, especially in high-temperature environments.

- Component Selection: Choose components with wide temperature ranges and high reliability ratings to ensure the overall system can withstand extreme temperatures.

- Encapsulation: Utilize appropriate encapsulation materials and techniques to protect the LCMXO2-256ZE-1SG32C device from moisture and humidity, minimizing the risk of performance degradation or failure.

- Testing and Validation: Conduct thorough testing and validation of the system under simulated extreme environmental conditions to assess the performance and reliability of LCMXO2-256ZE-1SG32C in real-world scenarios.

Performance Analysis:

In practical applications, LCMXO2-256ZE-1SG32C demonstrates reliable performance even in harsh environmental conditions. Its low-power characteristics make it suitable for battery-operated devices operating in remote or outdoor environments.

Application Scenario:

For example, in outdoor surveillance systems, LCMXO2-256ZE-1SG32C can be used for image processing and video analytics tasks while withstanding varying temperatures and humidity levels.

Circuit Design:

When designing circuits using LCMXO2-256ZE-1SG32C for extreme environments, pay attention to:

- Power Supply: Ensure stable power delivery to the FPGA and associated components, considering voltage fluctuations caused by temperature variations.

- Signal Integrity: Employ proper signal conditioning and noise reduction techniques to maintain signal integrity, especially in high-noise environments.

- Reliability Features: Utilize built-in reliability features of LCMXO2-256ZE-1SG32C, such as error correction mechanisms, to enhance system robustness.

- Environmental Testing: Subject the system to rigorous environmental testing, including temperature cycling and humidity exposure, to validate its performance and reliability under extreme conditions.

Conclusion:

LCMXO2-256ZE-1SG32C offers a reliable solution for applications requiring FPGA functionality in extreme environmental conditions. By considering thermal management, component selection, encapsulation, and rigorous testing, designers can ensure the performance and reliability of systems utilizing LCMXO2-256ZE-1SG32C in harsh operating environments.

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6. What is the process for return or replacement of LCMXO2-256ZE-1SG32C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO2-256ZE-1SG32C we delivered, we will accept the replacement or return of the LCMXO2-256ZE-1SG32C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO2-256ZE-1SG32C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations