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Name: LCMXO2-256HC-6MG132I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-256HC-6MG132I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2-256HC-6MG132I

Part No.:: LCMXO2-256HC-6MG132I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 132-LFBGA, CSPBGA

Datasheet:: LCMXO2-256HC-6MG132I.pdf

Description:: IC FPGA 55 I/O 132CSBGA

In Stock:: 3819

Quantity:: Add To Cart

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LCMXO2-256HC-6MG132I Specifications

Package/Case:
132-LFBGA, CSPBGA
Packaging:
Tray
Series:
MachXO2
ProductStatus:
Active
NumberofLABs/CLBs:
32
NumberofLogicElements/Cells:
256
TotalRAMBits:
-
NumberofI/O:
55
NumberofGates:
-
Voltage-Supply:
2.375V ~ 3.465V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

LCMXO2-256HC-6MG132I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-256HC-6MG132I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-256HC-6MG132I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2-256HC-6MG132I information

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LCMXO2-256HC-6MG132I performance and reliability evaluation in extreme environments

LCMXO2-256HC-6MG132I is a Field-Programmable Gate Array (FPGA) device known for its versatility and reliability in a wide range of applications. When deployed in extreme environments, such as those characterized by high temperatures, low temperatures, and high humidity, its performance and reliability become crucial factors to consider.

Environmental Considerations:

In the design phase, several environmental factors must be taken into account to ensure the LCMXO2-256HC-6MG132I operates optimally. High temperatures can impact the device's performance and longevity, potentially leading to thermal stress and accelerated aging. Conversely, low temperatures can affect the FPGA's functionality, slowing down its operation or causing it to malfunction. Moreover, humidity levels can cause corrosion and short circuits, posing a significant risk to the device's reliability.

Design Strategies:

To mitigate the effects of extreme environmental conditions, designers employ various strategies:

1. Thermal Management: Incorporating efficient heat dissipation mechanisms, such as heat sinks or fans, helps regulate the temperature around the LCMXO2-256HC-6MG132I and prevent overheating.

2. Environmental Sealing: Encasing the FPGA in protective enclosures or conformal coatings shields it from moisture and contaminants, enhancing its resistance to humidity-induced damage.

3. Component Selection: Choosing components rated for extended temperature ranges ensures the LCMXO2-256HC-6MG132I can withstand extreme thermal variations without compromising performance.

4. Testing and Validation: Conducting rigorous testing under simulated environmental conditions validates the FPGA's reliability and identifies potential failure points, allowing for preemptive measures to be implemented.

Performance Analysis:

In real-world applications, the LCMXO2-256HC-6MG132I has demonstrated exceptional performance even in the harshest environments. Its robust architecture, coupled with advanced manufacturing techniques, ensures reliable operation across a wide temperature range (-40°C to 125°C) and humidity levels (up to 95% RH).

Case Study:

For instance, in aerospace applications where temperature extremes and high humidity are common, the LCMXO2-256HC-6MG132I has been deployed successfully in onboard control systems and data processing units. Through meticulous design considerations and stringent testing protocols, these systems have exhibited consistent performance and longevity, even in challenging operating conditions.

Conclusion:

Overall, the LCMXO2-256HC-6MG132I exemplifies resilience and reliability in extreme environments, thanks to proactive design strategies and thorough validation processes. By addressing environmental concerns upfront and leveraging its inherent robustness, the FPGA proves to be a dependable solution for mission-critical applications across various industries.

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6. What is the process for return or replacement of LCMXO2-256HC-6MG132I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO2-256HC-6MG132I we delivered, we will accept the replacement or return of the LCMXO2-256HC-6MG132I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO2-256HC-6MG132I.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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