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Name: LCMXO2-2000ZE-2BG256I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-2000ZE-2BG256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2-2000ZE-2BG256I

Part No.:: LCMXO2-2000ZE-2BG256I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LFBGA

Datasheet:: LCMXO2-2000ZE-2BG256I.pdf

Description:: IC FPGA 206 I/O 256CABGA

In Stock:: 2489

Quantity:: Add To Cart

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LCMXO2-2000ZE-2BG256I Specifications

Package/Case:
256-LFBGA
Packaging:
Tray
Series:
MachXO2
ProductStatus:
Active
NumberofLABs/CLBs:
264
NumberofLogicElements/Cells:
2112
TotalRAMBits:
75776
NumberofI/O:
206
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

LCMXO2-2000ZE-2BG256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-2000ZE-2BG256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-2000ZE-2BG256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2-2000ZE-2BG256I information

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LCMXO2-2000ZE-2BG256I performance and reliability evaluation in extreme environments

LCMXO2-2000ZE-2BG256I is a field-programmable gate array (FPGA) chip known for its reliability and versatility, widely used in various electronic applications requiring programmable logic solutions. It offers a balanced mix of low power consumption, high performance, and small form factor, making it suitable for diverse embedded designs.

Application Scenario:

In aerospace and defense systems, LCMXO2-2000ZE-2BG256I plays a critical role in implementing custom logic functions, signal processing, and interfacing with sensors and actuators. Its reprogrammable nature allows for adaptability to evolving mission requirements.

Design Considerations:

When incorporating LCMXO2-2000ZE-2BG256I into a design, several environmental factors must be taken into account to ensure reliable operation:

- Temperature: The FPGA must withstand extreme temperature ranges commonly encountered in aerospace applications, including both high-temperature environments, such as engine compartments, and low-temperature conditions at high altitudes. Thermal management techniques like heatsinking and airflow optimization are crucial to maintaining operational temperatures within safe limits.

- Humidity: Moisture ingress can degrade the performance and reliability of electronic components. Encapsulation techniques, conformal coatings, and proper sealing of enclosures are essential to mitigate the effects of humidity on LCMXO2-2000ZE-2BG256I and ensure long-term reliability.

- Vibration and Shock: Aerospace systems are subjected to significant mechanical stresses during operation, including vibration and shock. The FPGA package and mounting method should be chosen to withstand these mechanical forces and prevent damage to solder joints and internal connections.

- Radiation: Radiation exposure in space and high-altitude environments can cause single-event upsets (SEUs) and cumulative damage to electronic devices. Radiation-hardened FPGA variants or mitigation techniques such as error-correcting codes (ECC) should be considered for applications where radiation resilience is critical.

Performance Analysis:

In real-world applications, LCMXO2-2000ZE-2BG256I demonstrates robust performance and reliability under challenging environmental conditions. Through thorough testing and validation, designers can ensure that the FPGA meets the specified performance metrics and operates within the required environmental limits.

Conclusion:

Overall, LCMXO2-2000ZE-2BG256I offers a dependable solution for embedded systems requiring programmable logic capabilities in harsh environmental conditions. By addressing environmental considerations during the design phase and leveraging the FPGA's inherent flexibility, designers can achieve optimal performance and reliability in aerospace and defense applications.

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6. What is the process for return or replacement of LCMXO2-2000ZE-2BG256I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO2-2000ZE-2BG256I we delivered, we will accept the replacement or return of the LCMXO2-2000ZE-2BG256I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

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(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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