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Name: LCMXO2-2000ZE-2BG256C
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-2000ZE-2BG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2-2000ZE-2BG256C

Part No.:: LCMXO2-2000ZE-2BG256C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LFBGA

Datasheet:: LCMXO2-2000ZE-2BG256C.pdf

Description:: IC FPGA 206 I/O 256CABGA

In Stock:: 3727

Quantity:: Add To Cart

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LCMXO2-2000ZE-2BG256C Specifications

Package/Case:
256-LFBGA
Packaging:
Tray
Series:
MachXO2
ProductStatus:
Active
NumberofLABs/CLBs:
264
NumberofLogicElements/Cells:
2112
TotalRAMBits:
75776
NumberofI/O:
206
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

LCMXO2-2000ZE-2BG256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-2000ZE-2BG256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-2000ZE-2BG256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2-2000ZE-2BG256C information

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LCMXO2-2000ZE-2BG256C performance and reliability evaluation in extreme environments

LCMXO2-2000ZE-2BG256C is a low-cost, low-power FPGA (Field-Programmable Gate Array) device manufactured by Lattice Semiconductor. It is designed for various applications requiring programmable logic solutions, such as industrial automation, automotive electronics, and consumer electronics.

Environmental Considerations:

When designing with LCMXO2-2000ZE-2BG256C, it's crucial to consider its performance in extreme environmental conditions. Factors such as high temperature, low temperature, humidity, and mechanical stress can impact the reliability and functionality of the device.

High Temperature:

LCMXO2-2000ZE-2BG256C is designed to operate within a specified temperature range. Exceeding the maximum operating temperature can lead to device malfunction or permanent damage. Therefore, thermal management techniques such as heat sinks, fans, or proper ventilation should be employed to ensure the device operates within its temperature limits, especially in high-temperature environments.

Low Temperature:

Like high temperatures, extremely low temperatures can also affect the performance of LCMXO2-2000ZE-2BG256C. At low temperatures, the device may experience slower operation or even failure to function. Designers should select components and materials rated for low-temperature operation and consider implementing temperature compensation techniques to maintain device functionality in cold environments.

Humidity:

High humidity environments can introduce moisture, which may corrode the contacts or degrade the performance of LCMXO2-2000ZE-2BG256C. Conformal coating or encapsulation can be applied to protect the device from moisture ingress. Additionally, proper sealing of enclosures and periodic maintenance can help mitigate the effects of humidity on device reliability.

Mechanical Stress:

Physical shock or vibration can cause solder joint fatigue or dislodgement of components, impacting the reliability of LCMXO2-2000ZE-2BG256C in harsh environments. Designers should employ robust mechanical designs, such as shock-absorbing mounting techniques or conformal coating, to enhance the device's resistance to mechanical stress.

Performance in Practical Applications:

In industrial automation, LCMXO2-2000ZE-2BG256C can be utilized for tasks such as motor control, sensor interfacing, and communication protocol implementation. Its low power consumption and programmable logic fabric make it suitable for battery-operated or energy-efficient applications.

Circuit Design:

When designing circuits with LCMXO2-2000ZE-2BG256C, designers should consider:

- Power Supply: Ensure stable and clean power is supplied to the device to prevent voltage fluctuations or noise-induced errors.

- Signal Integrity: Proper signal conditioning and impedance matching techniques should be employed to maintain signal integrity and minimize signal distortion.

- Clocking: Clock distribution networks should be carefully designed to minimize clock skew and jitter, ensuring reliable operation of synchronous logic circuits.

- Thermal Management: Adequate heat dissipation measures should be implemented to prevent overheating and ensure the device operates within its temperature specifications.

Reliability Assessment:

To assess the reliability of LCMXO2-2000ZE-2BG256C in extreme environments, designers can perform accelerated life testing, environmental stress screening, and failure mode analysis. These tests help identify potential weak points in the design and validate the device's performance under challenging conditions.

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6. What is the process for return or replacement of LCMXO2-2000ZE-2BG256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO2-2000ZE-2BG256C we delivered, we will accept the replacement or return of the LCMXO2-2000ZE-2BG256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO2-2000ZE-2BG256C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations