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Name: LCMXO2-2000ZE-1FTG256I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-2000ZE-1FTG256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2-2000ZE-1FTG256I

Part No.:: LCMXO2-2000ZE-1FTG256I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LBGA

Datasheet:: LCMXO2-2000ZE-1FTG256I.pdf

Description:: IC FPGA 206 I/O 256FTBGA

In Stock:: 2351

Quantity:: Add To Cart

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LCMXO2-2000ZE-1FTG256I Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
MachXO2
ProductStatus:
Active
NumberofLABs/CLBs:
264
NumberofLogicElements/Cells:
2112
TotalRAMBits:
75776
NumberofI/O:
206
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

LCMXO2-2000ZE-1FTG256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-2000ZE-1FTG256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-2000ZE-1FTG256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2-2000ZE-1FTG256I information

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LCMXO2-2000ZE-1FTG256I performance and reliability evaluation in extreme environments

LCMXO2-2000ZE-1FTG256I is a field-programmable gate array (FPGA) chip manufactured by Lattice Semiconductor Corporation. It is designed to provide high performance and low power consumption, making it suitable for a wide range of applications, including industrial control, automotive electronics, and consumer electronics.

Environmental Considerations:

In the design of LCMXO2-2000ZE-1FTG256I-based systems, various environmental factors must be taken into account to ensure reliable operation under extreme conditions:

- High Temperature: The FPGA chip should be able to withstand elevated temperatures commonly encountered in industrial environments, such as manufacturing plants or automotive applications. Proper thermal management techniques, including heat sinks and thermal vias, may be employed to dissipate heat effectively and prevent thermal stress on the device.

- Low Temperature: Similarly, the chip should be able to operate reliably in cold environments, such as outdoor installations or freezer storage facilities. Cold temperature testing should be conducted to verify the chip's functionality and performance under such conditions.

- Humidity: Moisture ingress can potentially damage the FPGA chip and affect its performance. Therefore, proper encapsulation and sealing techniques may be implemented to protect the device from moisture and ensure long-term reliability in humid environments.

- Vibration and Shock: In applications where the system is subjected to vibration or mechanical shock, such as in automotive or aerospace applications, the FPGA chip should be rugged enough to withstand these conditions without experiencing electrical or mechanical failures. Robust packaging and mounting methods may be employed to enhance the chip's durability.

- Radiation: In certain specialized applications, such as space exploration or nuclear power plants, the FPGA chip may be exposed to ionizing radiation, which can cause radiation-induced single-event effects (SEE). Radiation-hardened designs or mitigation techniques, such as triple modular redundancy (TMR) or error-correcting codes (ECC), may be implemented to ensure the chip's reliability in radiation-rich environments.

Performance in Real-world Applications:

Despite the challenges posed by extreme environmental conditions, LCMXO2-2000ZE-1FTG256I has demonstrated excellent performance and reliability in various real-world applications:

- In industrial control systems, the FPGA chip provides fast and accurate processing capabilities for real-time control and monitoring tasks, even in harsh operating environments with high temperatures and humidity.

- In automotive electronics, LCMXO2-2000ZE-1FTG256I enables advanced driver assistance systems (ADAS) and infotainment features, delivering robust performance and functionality despite exposure to vibration, shock, and temperature variations.

- In consumer electronics, such as smart home devices and wearable gadgets, the FPGA chip offers low power consumption and small form factor, making it ideal for battery-powered and portable applications that may be exposed to varying environmental conditions.

Overall, LCMXO2-2000ZE-1FTG256I proves to be a versatile and reliable solution for applications requiring high performance and resilience in extreme environments, thanks to its robust design and advanced manufacturing technologies.

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6. What is the process for return or replacement of LCMXO2-2000ZE-1FTG256I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO2-2000ZE-1FTG256I we delivered, we will accept the replacement or return of the LCMXO2-2000ZE-1FTG256I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO2-2000ZE-1FTG256I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations