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Name: LCMXO2-2000HE-4FTG256I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-2000HE-4FTG256I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2-2000HE-4FTG256I

Part No.:: LCMXO2-2000HE-4FTG256I

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LBGA

Datasheet:: LCMXO2-2000HE-4FTG256I.pdf

Description:: IC FPGA 206 I/O 256FTBGA

In Stock:: 3902

Quantity:: Add To Cart

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LCMXO2-2000HE-4FTG256I Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
MachXO2
ProductStatus:
Active
NumberofLABs/CLBs:
264
NumberofLogicElements/Cells:
2112
TotalRAMBits:
75776
NumberofI/O:
206
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

LCMXO2-2000HE-4FTG256I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-2000HE-4FTG256I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-2000HE-4FTG256I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2-2000HE-4FTG256I information

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LCMXO2-2000HE-4FTG256I performance and reliability evaluation in extreme environments

LCMXO2-2000HE-4FTG256I is a field-programmable gate array (FPGA) device manufactured by Lattice Semiconductor Corporation. It is designed to offer high performance and flexibility for a wide range of applications, including industrial automation, automotive, consumer electronics, and more.

Environmental Considerations:

When designing with LCMXO2-2000HE-4FTG256I for extreme environments, several factors need consideration:

- Temperature: The device is designed to operate within a specified temperature range. Special attention should be given to thermal management to ensure reliable performance, especially in environments with high temperature fluctuations.

- Humidity: Moisture can affect the electrical properties of the device and lead to corrosion or short circuits. Proper encapsulation and conformal coating techniques should be employed to protect the device from moisture ingress.

- Vibration and Shock: Mechanical stresses from vibration and shock can impact the solder joints and overall reliability of the device. Secure mounting and shock-absorbing measures should be implemented to mitigate these effects.

- Chemical Exposure: Exposure to harsh chemicals can degrade the materials used in the device and compromise its functionality. Selection of compatible materials and protective coatings is essential for applications in chemically aggressive environments.

- Radiation: Radiation can induce faults in the FPGA configuration memory and disrupt normal operation. Radiation-hardened designs or shielding techniques may be necessary for applications in radiation-rich environments, such as space or nuclear facilities.

Performance Evaluation:

In practical applications, LCMXO2-2000HE-4FTG256I has demonstrated robust performance under extreme conditions. For example, in automotive systems subject to wide temperature variations and mechanical stresses, the FPGA has reliably handled real-time data processing and control tasks.

In industrial automation, where humidity and chemical exposure are concerns, the device has proven resilient with proper environmental protection measures. Its low power consumption and small form factor make it suitable for integration into compact and power-sensitive applications.

Reliability:

Through rigorous testing and validation, LCMXO2-2000HE-4FTG256I has shown high reliability in demanding environments. Long-term stability tests have confirmed its ability to maintain consistent performance over extended periods, ensuring uninterrupted operation in mission-critical systems.

Overall, LCMXO2-2000HE-4FTG256I offers a reliable solution for applications requiring FPGA functionality in extreme environments, provided proper design considerations and environmental protections are implemented.

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6. What is the process for return or replacement of LCMXO2-2000HE-4FTG256I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO2-2000HE-4FTG256I we delivered, we will accept the replacement or return of the LCMXO2-2000HE-4FTG256I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO2-2000HE-4FTG256I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations