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Name: LCMXO2-2000HE-4FTG256C
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-2000HE-4FTG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Lattice Semiconductor Corporation LCMXO2-2000HE-4FTG256C

Part No.:: LCMXO2-2000HE-4FTG256C

Manufacturer:: Lattice Semiconductor Corporation

Package:: 256-LBGA

Datasheet:: LCMXO2-2000HE-4FTG256C.pdf

Description:: IC FPGA 206 I/O 256FTBGA

In Stock:: 3244

Quantity:: Add To Cart

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LCMXO2-2000HE-4FTG256C Specifications

Package/Case:
256-LBGA
Packaging:
Tray
Series:
MachXO2
ProductStatus:
Active
NumberofLABs/CLBs:
264
NumberofLogicElements/Cells:
2112
TotalRAMBits:
75776
NumberofI/O:
206
NumberofGates:
-
Voltage-Supply:
1.14V ~ 1.26V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

LCMXO2-2000HE-4FTG256C this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including LCMXO2-2000HE-4FTG256C price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for LCMXO2-2000HE-4FTG256C to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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LCMXO2-2000HE-4FTG256C performance and reliability evaluation in extreme environments

LCMXO2-2000HE-4FTG256C is a high-performance FPGA (Field-Programmable Gate Array) chip designed for demanding applications, offering flexibility and reliability in extreme environments. This article explores its performance and reliability assessment in harsh conditions, considering factors such as high temperature, low temperature, humidity, and more.

Environmental Considerations:

Incorporating LCMXO2-2000HE-4FTG256C into system designs requires careful consideration of environmental factors to ensure optimal performance and longevity. The following aspects are crucial:

1. Thermal Management:

The FPGA chip is susceptible to damage or malfunctioning under high-temperature conditions. Hence, efficient thermal management techniques, including heat sinks, fans, or thermal vias, should be employed to dissipate heat and maintain the operating temperature within the specified range.

2. Cold Temperature Operation:

Extreme cold temperatures can affect the functionality of electronic components. Proper insulation and heating mechanisms may be necessary to prevent issues such as condensation and component freezing, ensuring reliable operation even in frigid environments.

3. Humidity Control:

High humidity levels can lead to corrosion and electrical shorts, posing a risk to the integrity of LCMXO2-2000HE-4FTG256C and associated circuitry. Employing conformal coatings and moisture-resistant packaging can mitigate these risks, enhancing the device's reliability in humid conditions.

Performance Evaluation:

To assess the performance and reliability of LCMXO2-2000HE-4FTG256C in extreme environments, comprehensive testing is imperative. The following methodologies can be employed:

1. Environmental Stress Testing:

Subject the FPGA chip to a range of temperature and humidity conditions, simulating the extremes it may encounter during operation. Monitor its performance and functionality under these stressors to identify any vulnerabilities or limitations.

2. Accelerated Aging Tests:

Expose the device to accelerated aging conditions, such as elevated temperatures and humidity levels, to evaluate its long-term reliability. Assess factors like device degradation, performance drift, and failure rates over extended periods.

3. Failure Analysis:

In the event of failure or malfunction, conduct thorough failure analysis to identify the root cause and potential areas for improvement. This may involve examining device-level characteristics, such as solder joints, material degradation, or electrical overstress.

Real-World Applications:

Despite the challenges posed by extreme environments, LCMXO2-2000HE-4FTG256C finds applications in various industries where reliability and performance are paramount. Examples include:

- Aerospace: In avionics and space systems, where temperature variations and radiation are prevalent, the FPGA chip enables critical functions such as data processing, communication, and control.

- Automotive: In automotive electronics, the FPGA's adaptability allows for real-time signal processing, sensor interfacing, and vehicle control, even in harsh operating conditions.

- Industrial Automation: In industrial settings, where temperature, humidity, and vibration levels can be extreme, the FPGA facilitates flexible control and monitoring of manufacturing processes, ensuring efficiency and reliability.

- Defense and Security: In military and security applications, the FPGA's ruggedness and reconfigurability support tasks such as signal processing, encryption, and surveillance in challenging environments.

Conclusion:

LCMXO2-2000HE-4FTG256C offers robust performance and reliability in extreme environments, thanks to its design considerations and comprehensive testing methodologies. By addressing environmental factors and conducting thorough evaluations, this FPGA chip proves instrumental in various mission-critical applications across industries.

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6. What is the process for return or replacement of LCMXO2-2000HE-4FTG256C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the LCMXO2-2000HE-4FTG256C we delivered, we will accept the replacement or return of the LCMXO2-2000HE-4FTG256C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of LCMXO2-2000HE-4FTG256C.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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